Electrolytic gold plating

Electrolytic Gold and Other
High-Performing Processes
for the Connector Industry

Auruna® 526 Electrolytic
Gold Cobalt plating process.
Auruna® 526 was developed for
barrel plating and vibrating basket
applications. It is one of many
electrolytic gold plating processes
developed by Umicore Galvanotechnik.
Features include:

Excellent throwing power

Superior metal distribution, especially for hollow parts

Deposit contains 0.1 to 0.3 weight % cobalt.

Simple bath maintenance

Long bath life – tolerant to metal impurities

Auruna® 8100 – High speed electrolytic gold cobalt
alloy deposition. One of many electrolytic gold plating
processes developed by Umicore Galvanotechnik.
Features of the system:

Deposition speed up to 440 microinches per minute

Bright, solderable deposit

Excellent abrasion resistance

Low contact resistance

Deposit alloy 0.1 to 0.3 weight % cobalt

Miralloy® Copper-Tin-Zinc alloy deposition. Miralloy® is a
neologism from the words “mirror” and “alloy” dating back to the
manufacturing of bronze mirrors in antiquity. The system will
deposit copper-tin or copper-tin-zinc alloys.
Features of Miralloy:

Non-magnetic deposit, suitable for high-frequency applications

Lead-free systems pass RoHS requirements

Excellent thickness distribution

Excellent abrasion resistance

Can be used as an alternative to silver due to superior
anti-tarnish characteristics

Good contact resistance values in sulphur – containing atmospheres.

Niphos is an electrolytic plating system that deposits a nickel-
phosphorus alloy of between 6 and 13 weight % phosphorus.
Features of the system:

Can be used in reel to reel, rack, and barrel applications

Current densities of up to 300 ASF are achievable

Better plated thickness distribution than pure nickel deposits

Better wear properties than electrolytic nickel

Excellent corrosion resistance

Can be used for connectors when combined with thin gold overcoat

Passes Bellcore GR-1217-CORE requirements when overcoated with gold.

Platinode® platinized titanium anodes used for precious
metal plating and non-ferrous base metal plating.
Features:

Extremely low porosity of the platinum coating

Anode life 2 to 3 times that of standard platinized anodes

High dimensional stability, no need for frames

Anodes can be formed to complex shapes.

Available in three mesh sizes

Available in two coating thicknesses

Single side or double side coated anodes available

Uyemura supplies the connector industry with electrolytic gold,
electrolytic gold cobalt, Auruna, Miralloy copper-tin-zinc,
Niphos electrolytic plating, nickel phosphorus, and
Platinode platinized titanium anodes.

Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011