Uyemura Announces "22,000-Hour Solution" to Tin Whiskers Formation

An important new technology from Uyemura
prevents whiskers formation in electroplated tin
for 22,000 hours – and longer.

GRX-70 is a unique, high-speed electrolytic plating process –
a breakthrough in the control of tin whiskers. Whisker
crystals of tin and tin-based alloys are the most common
culprits in the short circuiting of electronic components.
Most often, the cause of tin whiskers is compressive stress.
The proprietary technology developed by Uyemura dissipates
compressive stress, preventing whisker formation. GRX-70 is ideally suited for connectors and semiconductor lead frames.

Features include:

• High purity anode
• High deposition speeds for rackless and reel-to-reel processing
• High deposition efficiency over a wide current density range
• Bath is lead and fluoride free, and foam-resistant.
• Operating range is 113-131°F, with 122° the optimum.
• Film has a uniform white matt appearance; appearance after reflow
  is excellent. Carbon and sulfur concentrations in the film are very low.
• Excellent solderability.
  

Read: The Elimination of Whiskers from Electroplated Tin.
by Masanobu Tsujimoto, Don Gudeczauskas, and George Milad

Electrolytic Gold, Silver Replacement, Other High- Performing Processes for Connectors, Industrial Wires Auruna® 526 Electrolytic Gold Cobalt plating process. Auruna® 526 was developed for barrel plating and vibrating basket applications. It is one of many electrolytic gold plating processes developed by Umicore Galvanotechnik. Features include:   Excellent throwing power   Superior metal distribution, especially for hollow parts   Deposit contains 0.1 to 0.3 weight % cobalt.   Simple bath maintenance   Long bath life – tolerant to metal impurities Auruna® 8100 – High speed electrolytic gold cobalt alloy deposition. One of many electrolytic gold plating processes developed by Umicore Galvanotechnik. Features of the system:   Deposition speed up to 440 microinches per minute   Bright, solderable deposit   Excellent abrasion resistance   Low contact resistance   Deposit alloy 0.1 to 0.3 weight % cobalt Miralloy® Copper-Tin-Zinc alloy deposition is an excellent silver replacement. Miralloy is a neologism from the words “mirror” and “alloy” dating back to the manufacturing of bronze mirrors in antiquity. The system will deposit copper-tin or copper-tin-zinc alloys. Features of Miralloy:   Non-magnetic deposit, suitable for high-frequency applications   Lead-free systems pass RoHS requirements   Excellent thickness distribution   Excellent abrasion resistance   Excellent silver replacement due to superior anti-tarnish characteristics   Good contact resistance values in sulphur-containing atmospheres Niphos is an electrolytic plating system that deposits a nickel- phosphorus alloy of between 6 and 13 weight % phosphorus. Features of the system:   Can be used in reel to reel, rack, and barrel applications   Current densities of up to 300 ASF are achievable.   Better plated thickness distribution than pure nickel deposits   Better wear properties than electrolytic nickel   Excellent corrosion resistance   Can be used for connectors when combined with thin gold overcoat   Passes Bellcore GR-1217-CORE requirements when overcoated with gold. Platinode® platinized titanium anodes are used for precious metal plating and non-ferrous base metal plating. Features:   Extremely low porosity of the platinum coating   Anode life 2 to 3 times that of standard platinized anodes   High dimensional stability, no need for frames   Anodes can be formed to complex shapes.   Available in three mesh sizes   Available in two coating thicknesses   Single side or double side coated anodes available

Uyemura supplies the connector industry with high-speed electrolytic processes
that prevent tin whiskers, also electrolytic gold, electrolytic gold cobalt, Auruna,
Miralloy silver replacement, Niphos electrolytic plating, nickel phosphorus,
and Platinode platinized titanium anodes.