AudiologyNOW March 25-27
Europlasma Booth #209
Gonzalez Convention Cntr.
San Antonio, TX
International Microwave Symposium, May 17-22
Unimetal Booth #3514
Phoenix Convention Cntr.
SUR/FIN June 8-10
Stephens Convention Cntr.
Medtech MD&M November 4-5
Filtration International November 17-19
"Powered by science, focused on customers."
Uyemura provides exceptional, problem-solving finishing technology solutions, including the broadest
range of PCB finishes, ENIG, ENEPIG, ENAG, and much more.
ENEPIG Final Finish
ENEPIG produces a highly uniform EN deposit, followed by electroless palladium, with an immersion gold flash. It forms highly robust solder joints with lead-free SAC-type alloys, and is an excellent solution for IC package PCB substrates.
EVF-N DC Via Fill
Thru-Cup EVF-N plates copper
in through-holes and blind
vias simultaneously, cutting
process time by 50%. It
delivers exceptional perfor-
mance for blind via diameters
smaller than 150 micrometers.
Rich DePoto, Business Development Manager,
will deliver a talk at Sur/Fin Monday, June 8 in Rosemont. The talk is part of the event's Electronics Section and is titled "Advanced Nanochemistry Coating Produces Significant Corrosion Protection, and Allows Thickness Reductions for a Variety of Metals."
Rich DePoto was recently appointed Manager for Umicore products.
George Milad, Uyemura National Accounts Manager for Technology,
chaired the 4-14 PLATING PROCESSES SUBCOMMITTEE meeting at IPC/APEX. The committee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/immersion plating.
George Milad was interviewed by Guest Editor Mike Carano at APEX. View
Uyemura: A World Leader in ENIG, ENEPIG, Alkaline Copper,
Copper Roughening Products, and Immersion Silver