In Memory of Larry Baucom
Larry Baucom, Uyemura's sales manager for the southeast region prior to a tragic accident in 2009, passed away January 5.
Larry was one of the first sales employees of Uyemura USA, and one of the company's most valuable technical assets. He was widely respected for his extensive knowledge of both the PCB and GMF industries. Larry had years of hands-on production experience prior to joining Uyemura in 1992, having managed the plating department at a high-volume printed circuit shop in Richmond, Virginia. He was highly skilled in working with customers to solve problems and identify solutions.
Larry was an auto restoration hobbyist, and a nationally ranked bass fisherman. He is survived by his wife, Rhonda, and two stepdaughters. Larry will be keenly missed by the entire Uyemura family.
Milad Addresses India Printed Circuit Association
George Milad, Uyemura National Accounts Manager
for Technology, delivered two important talks at the
IPC Expo, August 3-5 in Bengaluru.
"New Developments in Acid Copper DC Plating for
Vertical Tank Applications" covered new chemical
additives that directly affect thickness distribution,
and chemical systems designed to fill blind via holes.
It also covered optimization of plating cell geometry,
proper mass transfer, and the use of insoluble anodes
with CuO replenishment.
The second presentation, "Understanding and Eliminating
Black Pad from ENIG Deposits," covered BP formation,
and determining whether a phosphorous-enriched
layer is an indicator of Ni corrosion, along with
mitigation strategies.


30 Years of MIRALLOY®:
A Major Success Story for Uyemura Customers
MIRALLOY copper-tin and copper-tin-zinc electrolytes are now used by leading
manufacturers worldwide for nickel-free coating of zippers, snaps, costume jewelry
and RF connectors. It is also an excellent silver replacement, thanks to its superior
anti-tarnish characteristics.
Miralloy is a registered trademarked of Umicore-GT.

New Technologies from MEC Company LTD
Deliver Maximum Adhesion, Less Waste,
Low Energy Processing
Our H2SO4-H2O2-type microetching agent is an exceptional alternative to
black oxide treatment. The unique surface topography produced enhances the
adhesion of copper to all resins including high Tg and HF (halogen-free).
MEC COPPERSEAL Organic Solderability Preservative enhances solderability
by forming an anti-tarnish film that provides exceptional resistance to moisture
and heat.
MEC ETCHBOND is a single-component copper treatment for use prior to
resist or soldermask. Its unique surface topography provides the very best
adhesion on resin systems.
 
Uyemura’s RGA Immersion Silver
meets every requirement for a
RoHS and WEEE-compliant
board finish:
- High-density mounting
- Excellent BVH coverage
- Prevents copper oxidation during high-temp assembly
- No planar micro voids
- Low chemical cost
- Meets IPC 4553 for lead-free
Watch RGA Immersion Silver animation. Go to Immersion Silver page.
 
New GMF newsletter discusses a
silver and platinum replacement that
is tarnish-free, even under harsh conditions,
with high wear and corrosion resistance.
Also, advanced technology that prevents
whisker formation in electroplated tin for
22,000 hours – and longer.

New issue of ClearSignals Newsletter
discusses new ENEPIG research, 4-14 Plating Subcommittee proposals, a new treatment for high frequency PCBs, acid copper via filling in 50% less time - and competitor time warps.
 NEW!
Bilingual brochure
from Uyemura
discusses Umicore
Galvanotechnik
precious metal
electrolytes for
functional and
decorative plating
Uyemura: A World Leader in Electroless Nickel /Immersion Gold, Alkaline Copper,
Decorative Black Nickel, HASL alternative products, and Immersion Silver. Uyemura specializes in electroless nickel / immersion gold, decorative
black nickel, HASL alternative products, immersion silver, lead and
cad-free finishes, electroless nickel, diamond reflective finishes, and
alternatives to black oxide. Other industry-leading UIC finishes are acid copper DC electroplate,
ENIG, ENEPIG, ENAG, gold wire bonding, electrolytic nickel gold, immersion silver,
immersion tin, and under bump metallization processes for aluminum and
aluminum alloys, and copper. 
UYEMURA Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635 UYEMURA Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011 © Copyright 2012. Website designed by www.marketingservicesinc.com • links |