ENIG electroless nickel / immersion gold plating, immersion silver plating, EN plating on aluminum, alkaline copper

CL-NC alkaline copper, ENIG electroless nickel / immersion gold plating and immersion silver plating, EN plating on aluminum

Uyemura is the world leader in electroless nickel/ immersion gold, immersion silver, and immersion tin; also copper etchants and acid copper finishes, plus decorative black nickel.


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New Technologies from
MEC Company LTD
Deliver Maximum
Adhesion, Less Waste,
Low Energy Processing

Our H2SO4-H2O2-type
microetching agent was developed as
an alternative to black oxide treatment.
The unique surface topography produced
enhances the adhesion of copper to all
resins including high Tg and HF (halogen-free).
It has proven to provide the highest-available
peel strength in the industry, while having a
high copper capacity (45 g/l) for less waste.
Its bath operates at low temperature and is
engineered to be sludge-free for up to 1 year.
It offers the best performance with
all materials.

MEC COPPERSEAL Organic Solderability
Preservative enhances solderability by
forming an anti-tarnish film that provides
exceptional resistance to moisture and heat.
It was engineered as a low-energy consuming process, is usable at room temperature, and is
environmentally friendly. It is compatible with
lead-free solder and maintains excellent
solderability after multiple heat shocks.

MEC ETCHBOND is a single-component
copper treatment for use prior to resist or
soldermask. Its unique surface topography
provides the very best adhesion on resin
systems. It has a stable etching rate, and
provides maximum soldermask adhesion
at a low etch (less than 40 µ inch). It’s
single component system, coupled with its
high copper capacity (55 g/l) reduces
storage needs and minimizes waste.

What Else?

Non-metallic additive
stops tin whiskers.

New-gen lead and cad-free EN
Process is “green” and stable.

Uyemura EVF acid copper fills blind
vias in 45-60 minutes (not 4 hours!),
for better process results and major
cost advantages!

New multi-functional EVF-T fills blind vias
and plates thru-holes simultaneously.
Learn more

SN1 Black bright tin / nickel plating
process is applied over bright or satin
nickel undercoating. Better corrosion
resistance than tin / cobalt; compatible
with barrel plating. MORE

CL Tin Cobalt SNC Black produces
a highly uniform black / anthracite
appearance. Deposit over bright
nickel or bright copper; rack or
barrel application. MORE

CL-NC Alkaline Copper:
the First-Ever Solution for
Direct Plating on Aluminum

If you need to eliminate cyanide in
the wastewater and a cyanide destruct
system . . . if you’re looking for a new
aluminum plating system that doesn’t
require the make-up and maintenance
of zincate . . . CL-NC Alkaline Copper
from Uyemura is the technology
you’ve been looking for.

CL-NC Alkaline Copper is a cyanide-free,
semi-bright copper electroplating process
that’s compatible with both rack and
barrel applications.

This unique process is also compatible
with most base metals. Copper can be
plated directly on aluminium and on most
aluminium alloys that contain <1% silicon,
without the need for any zincate processing.
Aluminium 6061, 5052, 2024 and 1008 are
examples of popular alloys that are
successfully plated. CL-NC Alkaline Copper
replaces the cyanide copper strike used
prior to zinc die cast plating.

CL-NC Alkaline Copper has a neutral
(7-8.5) pH, and plates at 140-158°F.
It is ideal as a base for bright nickel /
microcrack / chromefinishing, and, when
used with a nickel barrier, as a base for
plating gold. Applications such as the
wheel shown here, plumbing products,
appliances, bicycle hubs and clothing
fasteners all benefit highly from CL-NC
processing.

CL-NC Alkaline Copper was developed by
CL Technologies-Germany.

Is your alloy plate-able?
Send us a sample, and let’s see
what’s possible.

left to right: Tom Walsh, Don Walsh, Shunsaku Hoshi, George Milad, Laura Hanna and Don Gudeczauskas Uyemura USA President Tony Revier (left) and Director of Operations Don Walsh (right) congratulate West Coast Sales Manager Arnie Kremer on his 10 years of service to the company.

IPC 2010 proved an exceptional opportunity for Uyemura management and technical
specialists to meet with customers and prospective customers who had contacted us regarding
CL-NC Alkaline Copper and other new technologies. Among those representing Uyemura,
in photo above left, starting from left to right: Tom Walsh, Don Walsh, Shunsaku Hoshi,
George Milad, Laura Hanna and Don Gudeczauskas. Attendance figures for the 4-day event,
released April 20, indicated a 10% increase over last year, with 3,702 attendees. In all,
6,683 attendees and exhibitors representing 41 countries participated in IPC APEX EXPO,
the largest event in North America dedicated to the electronic interconnection industry.

Also at IPC in above right photo: Uyemura USA President Tony Revier (left) and
Director of Operations Don Walsh (right) congratulate West Coast Sales Manager
Arnie Kremer on his 10 years of service to the company.

Uyemura’s RGA Immersion Silver
meets every requirement for a
RoHS and WEEE-compliant
board finish:

High-density mounting
Excellent BVH coverage
Prevents copper oxidation during high-temp assembly
No planar micro voids
Low chemical cost
Meets IPC 4553 for lead-free

Watch RGA Immersion Silver animation. Go to Immersion Silver page.

Uyemura Expands Sales and Support Resources
in Southern California Region

Uyemura USA is pleased to announce that
Paramount USA, a prominent supplier of
primarily laminate and prepreg products,
will represent Uyemura PCB product lines in
southern California. The announcement was
made by Uyemura Director of Operations,
Don Walsh.

According to Paramount Sales Manager,
Mike Muck, “we think this is a very strategic
‘fit’ that will serve our existing customers well,
and create new opportunities for companies
who want a fully integrated solution.”

Although representing the entire Uyemura PCB product line,
Paramount will, according to Walsh, focus primarily on ENIG,
immersion silver and other final finishes, EPL acid copper,
EVF via fill coppers, electroless golds and palladiums.
Paramount will also represent micro-etchants manufactured
by MEC, and Umicore-Galvanotechnik gold processes,
two product lines available in North America exclusively
through Uyemura.

Paramount USA was founded in 1994. Its offerings include
laminates, entry and back-up products, and production materials
and films, in addition to chemistries. It also provides stock
management and product support.

Paramount USA and Uyemura are both members of IPC,
a global association serving the electronic interconnection industry.
Southern California has North America’s largest concentration of
PCB manufacturers. The world market for PCBs is projected to
top $76 billion by 2015.

Uyemura Expands Technical Team

UIC Director of Operations Don Walsh has announced
two new Tech Center appointments. Shunsaku Hoshi,
formerly with Uyemura’s Central Research labs in
Hirakata, Japan, will shortly become part of the US Tech
Center’s R&D and technical support team. Mr. Hoshi’s
specialty is copper chemistry, and his appointment
comes as interest is growing in Uyemura’s copper
products, including EPL, ETN, and EVF.

Marc DePallo, formerly with Pharmacal Research
Laboratories, a manufacturer of commercial cleaners
for biomedical research, has been brought on-board
as a chemical blender.

Director of Operations Don Walsh and National Accounts Manager
George Milad were featured in a short video produced at IPC that
discusses, among other things, IPC’s new ENEPIG specification.
VIEW NOW

UIC is C-TPAT Certified

UIC has been designated a certified partner in the Customs-Trade
Partnership Against Terrorism (C-TPAT). C-TPAT is a program of CBP
(Customs and Border Protection), America's single unified border agency.

Uyemura is the first manufacturer of plating chemistries,
(in fact, one of the first companies in the world) to be awarded
ISO 9001:2008 certification, with zero nonconformance items
noted. We would like to recognize the excellent work of David Liston,
Quality Manager, and Patricia Wolowicz, Tech Center Office Manager,
for their efforts in achieving this landmark distinction.

GMF newsletter discusses
CL-NC Alkaline Copper, the
first-ever solution for direct
plating on aluminum, with
comments from the first
commercial user;
also new decorative
plating options.

ClearSignals Newsletter discusses
source of new ENEPIG buzz, immersion
tin chemistry for mitigating tin whiskers,
strategies for managing precious metals
prices, and new MEC technologies for low
energy processing.

NEW!
Bilingual brochure
from Uyemura
discusses Umicore
Galvanotechnik
precious metal
electrolytes for
functional and
decorative plating

Uyemura: A World Leader in Electroless Nickel /Immersion Gold, Alkaline Copper,
Decorative Black Nickel, HASL alternative products, and Immersion Silver.

Uyemura specializes in electroless nickel / immersion gold, decorative
black nickel, HASL alternative products, immersion silver, lead and
cad-free finishes, electroless nickel, diamond reflective finishes, and
alternatives to black oxide.

Other industry-leading UIC finishes are acid copper DC electroplate,
ENIG, ENAG, gold wire bonding, electrolytic nickel gold, immersion silver,
immersion tin, and under bump metallization processes for aluminum and
aluminum alloys, and copper.

UYEMURA Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

UYEMURA Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011