Uyemura provides exceptional, problem-solving finishing technology solutions, including the
broadest range of PCB finishes, ENIG, ENEPIG, ENEG, ENAG, and much more.
RMK-25 Immersion Tin is Cleaner, More Uniform, and 3x Faster
RMK-25 is ideally suited for backplane and other press fit applications.Read more
RMK-25, Uyemura's highly successful immersion tin, has been reinvented for the new requirements
of solderability and long-term solder integrity. It also offers:
Ionic cleanliness: board cleanliness capability at 40% below IPC specification
A fine grain crystalline deposit with excellent wettability
Thickness control at 1.5 standard deviation from the mean
Process cycles that are 3X faster than the competitive average
A flat microstructure with excellent aesthetics, minimal copper etchback
NASF President's Farewell Message By: Tony Revier
It has been my great pleasure to work with the capable, talented, and dedicated team of professionals that comprise the NASF board and staff. My time on the Board has been rewarding and productive beyond my expectations, and we have made important progress on several fronts that will serve our nation and our industry well in the coming decades. Read full message
"ENEPIG is here to stay, with exceptional prospects for future growth"
“ENEPIG is the future,” according to George Milad, Chairman of the IPC Plating Committee.
In an interview conducted at IPC Midwest, IPC’s Ray Rasmussen discusses with Milad the critical performance and application distinctions between ENIG and ENEPIG, as well as the Plating Committee’s upcoming work on specifications for nickel silver, palladium on copper and palladium gold on copper.
George Milad is Uyemura’s National Accounts Manager for Technology. Uyemura has a longstanding commitment to the mission
of IPC; its top management serves on the IPC Supplier Committee, Government Relations Committee and Plating Committee.
Uyemura ENEPIG is as Close to Indestructible as a Final Finish Can Be
ENEPIG from Uyemura produces a highly uniform EN deposit, followed by electroless palladium, with an immersion gold flash. It also:
Forms highly robust solder joints with lead-free SAC-type alloys
Provides an excellent solution for IC package
PCB substrates, particularly ceramic-based
Is immune to black pad
Prevents BGA fractures, and can replace the
SET used for HDI cellular phone PCBs
News from Tech Knowledge
Uyemura’s work with Israel-based Tech Knowledge grows each year. Recently, the company, based in Tel Aviv, expanded into a new facility, and substantially enhanced its quality testing capabilities for customers in the PCB and electronic interconnect industries. Now, in addition to traditional thermal shock testing, TK has the first HATS thermal shock testing system in the Middle East or Europe.
HATS, or Highly Accelerated Thermal Shock System, is a patented thermal shock reliability test based on conventional air-to-air thermal cycling. The system uses a single chamber in which high volume hot and cold air alternatively pass stationary samples, providing rapid thermal transfer and reducing the time for the samples to reach temperature equilibrium.
In the photo, taken in the new TK facility are (left to right): Bob Neves, Chairman and CTO, Microtek Laboratories; Yaakov Leibowitz, TK Lab Manager; Otzmi Gitlin, Technologist, TK Lab; Fanny Piraz, Sales Manager, TK.
New Research Facility Marks Milestone for Finishing Research
Uyemura will substantially expand its research capacity when its new R&D facility opens June 4 at Uyemura Central Labs in Hirakata, Japan.
The facility will be the largest of its kind in the world devoted to finishing technology. It will emphasize high impact research and new product development for Uyemura customers throughout the general metal finishing industries, as well as within the printed circuit, and semiconductor space. As always, part of Uyemura's mission is to provide expert analytical and consultative services to industry, and to help customers gain a meaningful competitive advantage in their markets.
Copper Treatment for High Frequency PCBs
Uyemura, North America's exclusive representative for MEC Company LTD, announces the commercial availability of MEC FlatBOND GT, a new copper surface treatment process for high frequency PCBs. FlatBOND GT provides a profile-free surface, and high adhesion performance with insulation materials. It can deliver sufficient adhesion strength for low dielectric resin, although the treated surface is flat.
The photo shows the copper pattern before and after treatment. Because the copper remains unchanged, there is no signal loss.
EVF-N: Acid Copper Via Filling
in Half the Process Time
EVF-N plates through-holes and vias simultaneously, cutting process times by 50%. It delivers exceptional performance for hole diameters smaller than 150 micrometers. Designed for soluble anodes, it is suitable for both pattern and through-hole plating. For details, contact your Uyemura representative.
CL-NC Alkaline Copper for Direct Plating on Aluminum
CL-NC Alkaline Copper from Uyemura is a cyanide-free,
semi-bright copper electroplating process that’s
compatible with aluminum, and most base metals.
If your goal is to eliminate cyanide in the wastewater...
if you’re looking for an aluminum plating system that doesn’t require zincate make-up and maintenance...
CL-NC Alkaline Copper from Uyemura is the technology you’ve been looking for.
CL-NC Alkaline Copper offers exceptional adhesion properties, and is ideal as a base for bright nickel / microcrack / chrome finishing, and, when used with a nickel barrier, as a base for plating gold. Applications such as bicycle hubs, apparel fasteners and aluminum extrusions all benefit.