Half-day Workshop:
Lead-Free Surface Finishing for PWB
Surface finish is about connectivity. It is the surface through which the connection
from the board to a device occurs. Ball grid arrays, wire bonding pads, press fit,
and contact switches are all outside the traditional realm of HASL and electrolytic
nickel gold tab plating and require innovative solutions.
This workshop will focus on the alternatives: electroless nickel/immersion gold,
electroless gold, immersion silver, immersion tin, OSP, electroless palladium as
well as direct gold on copper.
Deposit description, thickness requirements, method of manufacturing, shelf life,
application, limitations and relative cost will be covered in detail, from design
thru assembly.
RoHS compliance requires the use of Lead Free (LF) solder like the higher
melting temperature SAC alloy (tin/silver/copper). How will the present lineup
of surface finish products fare under these new high temperature conditions?
Are changes needed? What effects does this higher temperature have on
the integrity of the solder joint? etc.