Electroless Gold,
Electroless Nickel, and
Electrolytic Tin
for
Ceramic Substrates
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AuBEL Electroless Gold
– Stable,
alkaline pH, autocatalytic process.
Proven
over time, this system has been used
in
production for more than 15 years.
Properties
of the system:
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High deposition
rate of 80 microinches per hour |
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Pure gold deposit,
greater than 99.9% |
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Excellent gold wire
bond properties |
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Gold and reducer can
be replenished |
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BEL-801
Electroless Nickel
– Boron electroless nickel for
deposition over metallized ceramic substrates.
System operates
at a neutral pH. Features include:
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Excellent
solderability |
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Nickel purity over
99% |
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High as-plated hardness
of approximately 800 Hv |
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High conductivity
electroless nickel deposit |
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Fast initiation onto
catalyzed surfaces, thus eliminating skip
plating |
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Long bath life of
up to 5 metal turn overs |
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Pre-Treatment
for Electroless Plating of Metallized
Ceramics –
Uyemura has
a variety of pre-treatment processes
available for the
cleaning and activation of metallized
ceramics. Specific systems are
available for standard ceramics, low
temperature co-fired ceramics,
glass ceramics, and aluminum nitride.
The net result is a uniform
catalyzation of the metallized surface
without damage to the
underlying ceramic substrate. |
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Thru-Nic
CL – Super
high throwing power electrolytic nickel.
One disadvantage of sulfamate or sulfate-based
electrolytic nickels
is the lack of throwing power, or the
inability to deposit nickel in
multiple locations without elaborate
anode-cathode arrangements.
These problems
are eliminated with Thru-Nic. Thru-Nic
typically
yields a 5-fold increase in throwing
power over standard nickel
systems. The net result is an improvement
in both quality
and productivity.
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NTB-302 electrolytic tin produces a uniform coating of pure tin for chip
resistors, chip capacitors, chip inductors, and other applications that can’t be
exposed to acidic solutions. Deposited film of electrolytic tin has exceptionally
uniform grain structure, plus:
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~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Read "Electroless Plating for LTCC Metallization"
published in Ceramic Industry magazine.
Read "Neutral Autocatalytic Electroless Gold
Plating Process" in our Library section.
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Uyemura supplies electroless gold, electroless nickel, boron electroless nickel,
electrolytic nickel; electrolytic tin; also pretreatment for electroless plating of
metallized ceramics.
Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635
Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011
© Copyright 2009. Website designed by www.marketingservicesinc.com
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