Electroless Gold, Electroless Nickel, Electrolytic Tin for ceramicElectroless Gold, Electroless Nickel, Electrolytic Tin for ceramicElectroless Gold, Electroless Nickel, Electrolytic Tin for ceramic
Semiconductor Industry:

Uyemura:
World leader in
Electroless Gold
Plating,
LTCC
Metallization,
and
Electrolytic Tin


Electroless Gold,
Electroless Nickel, and
Electrolytic Tin for
Ceramic Substrates

Electroless Gold, Electroless Nickel, Electrolytic Tin for ceramic
Electroless Gold, Electroless Nickel, Electrolytic Tin for ceramic
Electroless Gold, Electroless Nickel, Electrolytic Tin for ceramic


AuBEL Electroless Gold
Stable,
alkaline pH, autocatalytic process. Proven
over time, this system has been used in
production for more than 15 years.
Properties of the system:

 
High deposition rate of 80 microinches per hour
 
Pure gold deposit, greater than 99.9%
 
Excellent gold wire bond properties
 
Gold and reducer can be replenished
   
BEL-801 Electroless Nickel – Boron electroless nickel for
deposition over metallized ceramic substrates. System operates
at a neutral pH. Features include:

 
Excellent solderability
 
Nickel purity over 99%
 
High as-plated hardness of approximately 800 Hv
 
High conductivity electroless nickel deposit
 
Fast initiation onto catalyzed surfaces, thus eliminating skip plating
 
Long bath life of up to 5 metal turn overs
   
Pre-Treatment for Electroless Plating of Metallized Ceramics
Uyemura has a variety of pre-treatment processes available for the
cleaning and activation of metallized ceramics. Specific systems are
available for standard ceramics, low temperature co-fired ceramics,
glass ceramics, and aluminum nitride. The net result is a uniform
catalyzation of the metallized surface without damage to the
underlying ceramic substrate.
   
Thru-Nic CLSuper high throwing power electrolytic nickel.
One disadvantage of sulfamate or sulfate-based electrolytic nickels
is the lack of throwing power, or the inability to deposit nickel in
multiple locations without elaborate anode-cathode arrangements.

These problems are eliminated with Thru-Nic. Thru-Nic typically
yields a 5-fold increase in throwing power over standard nickel
systems. The net result is an improvement in both quality
and productivity.

   

NTB-302 electrolytic tin produces a uniform coating of pure tin for chip
resistors, chip capacitors, chip inductors, and other applications that can’t be
exposed to acidic solutions. Deposited film of electrolytic tin has exceptionally
uniform grain structure, plus:

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Read "Electroless Plating for LTCC Metallization"
published in Ceramic Industry magazine.

Read "Neutral Autocatalytic Electroless Gold
Plating Process"
in our Library section.
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Uyemura supplies electroless gold, electroless nickel, boron electroless nickel,
electrolytic nickel; electrolytic tin; also pretreatment for electroless plating of
metallized ceramics.

Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011


Electroless Gold, Electroless Nickel, Electrolytic Tin for ceramic

© Copyright 2009. Website designed by www.marketingservicesinc.com


Electroless Gold, Electroless Nickel, Electrolytic Tin for ceramic