Uyemura is the world leader in electroless nickel/ immersion gold, immersion silver, and immersion tin; also copper etchants and acid copper finishes, plus decorative black nickel.Uyemura is the world leader in electroless nickel/ immersion gold, immersion silver, and immersion tin; also copper etchants and acid copper finishes, plus decorative black nickel.Uyemura is the world leader in electroless nickel/ immersion gold, immersion silver, and immersion tin; also copper etchants and acid copper finishes, plus decorative black nickel.

Uyemura:
World Leader
in Plating
Performance


FAQs on Plating, Final Finishes
and Decorative Black Nickel


1. How does Copper Gobbler save dollars for PCB
processors?


Copper Gobbler is a copper digester that works with
Uyemura’s acid copper chemistry in a system called EZ
Plate. EZ Plate eliminates the need for copper anodes,
thus removing the primary source of nodules; reduces downtime for maintenance
and dummying; ends anode sludge clean-up and reduces copper costs. The system
also produces an end result visibly superior to ordinary copper plating.
   
2. How can Uyemura’s ENIG be gentler on solder masks?

Because we run at low temperature, and our ENIG formula has zero chlorides.
   
3. What are ENIG’s main advantages for printed circuit manufacturers,
and what component assembly methods are compatible with it?


Wave soldering, solder fusing and wire bonding are all compatible with electroless
nickel immersion gold finishes. ENIG creates a highly solderable surface that won’t
discolor, or tarnish, and it provides exceptional electrical continuity. The nickel
component provides a barrier against copper diffusion and guards against
contamination of the solder during soldering and re-work. ENIG also contributes
EMI shielding.
   
4. What is meant by the term “direct gold” and where is direct gold used?

Direct gold is application directly on copper – without nickel. Direct gold is used primarily
wherever RF interference is a factor.
   
5. What are the most compelling advantages of Uyemura GT platinized anodes?

No micro-pores, and no micro-cracks—thus longer life. Also, these rigid frameless
platinum anodes can be double or single-sided, and are manufactured in several
mesh sizes.
   
6. What is “white bronze?”

White bronze is a white version of Miralloy, the electroplating alloy combination of tin,
copper and zinc that’s become the preferred alternative to nickel for many applications.
Among these applications are jewelry, zippers, buttons and other products that contact
the skin. About 20% of the population has a dermatological reaction to nickel, and
no-nickel Miralloy eliminates this problem. White bronze Miralloy is inert, long-lived
and tarnish-free. There’s also a lead-free formula.
   
7. What alternatives are there to silver and nickel for the connector and
electronic component industries, where there’s an issue over intermodulation
or tarnishing?


Miralloy, the copper-tin-zinc alloy, produces a bright, white finish and provides
excellent corrosion performance, high solderability and conductivity. It is also
diamagnetic, and won’t tarnish.
   
8. Does “white bronze” also have other uses?

Yes. In addition to being an excellent finish for products such as jewelry and zippers
and other consumer products that contact the skin, white bronze is an excellent finish
for countertops in physicians offices and hospitals, on knife racks and shelving in
restaurants, on door knobs – and on bathroom fixtures, changing tables, toys, etc.
   
9. What makes EtchBOND copper surface treatment superior to black oxide?

EtchBOND has peel strength substantially higher than any hot or “low temperature”
black oxide treatments.
   
10. Is there a solution to “black pad” or “black nickel” defects in electroless
nickel immersion gold used in the PCB industry?


The black pad seen with ENIG processing causes solder joint failure and low shear
forces after assembly. It indicates a problem with the nickel bath that causes nickel
corrosion during immersion gold deposition. Uyemura’s KAT ENIG process was
engineered specifically to eliminate it, while maximizing yields.
   
11. Are there alternatives to watts, sulfamate or sulfate-based baths that
deliver higher throwing power for electrolytic nickel?


Uyemura’s Thru-Nic process provides substantially higher throwing power for your
nickel plating process – users typically experience a 5-fold increase in throwing power
over standard nickel systems. Thru-Nic AMT is engineered specifically for PC board
applications; Thru-Nic CL is formulated for ceramic IC packages and general
metal finishing.
   
12. Is there a way to reduce or eliminate the need for dummy plating?

Yes. Uyemura’s Nimuden NPR4, NPR6 and HDX+D electroless nickel baths eliminate
dummy plating and wasted chemistry. When operated with Uyemura’s StarLine Dash NP
Chemical controller, the most consistent, most reliable plating results can be achieved.
   
13. From an operations standpoint, what's the main advantage of Nickstar
decorative black nickel plating, compared to conventional black nickel?


Nickstar can be operated at higher current density to get better plating coverage,
specifically  5-8 asf vs. 1-3 asf.
   
14. How does Nickstar's cycle time compare to older black nickel?

Nickstar achieves a deep black deposit in 5-10 minutes, compared with 15-20 minutes
required by traditional black nickel products.




Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011


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Uyemura is the world leader in electroless nickel/ immersion gold, immersion silver, and immersion tin; also copper etchants and acid copper finishes, plus decorative black nickel.