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Uyemura is proud to announce that it has become the first
manufacturer of plating chemistries, (in fact, one of the first
companies in the world) to be awarded ISO 9001:2008 certification,
with zero nonconformance items noted. We would like to recognize
the excellent work of everyone, in particular, David Liston, Quality
Manager, and Patricia Wolowicz, Tech Center Office Manager, for
their efforts in achieving this landmark distinction.
ISO 9001:2008 is a comprehensive Quality Management
System that requires a company to consistently provide product
that meets customer and regulatory requirements, and enhances
customer satisfaction through the effective application of the
system. Most notably, the ISO 9001-2008 quality system
assures Uyemura customers that Uyemura management is
committed to continuous improvement and customer satisfaction.
In bringing our quality system into conformance with
ISO 9001-2008 requirements, Uyemura trained a team of
in-house auditors representing all areas of the company,
who as a group are responsible for ongoing review of all
aspects of the quality system.
Uyemura is a company “powered by science, and focused
on customers.” We are dedicated to providing exceptional,
problem-solving finishing technology solutions that give
customers a defined and significant advantage in finishing
performance. And to helping them develop cost-saving
strategies that will enhance their productivity and
competitiveness in this challenging business climate.
UIC is C-TPAT Certified
UIC has been designated a certified partner in the Customs-Trade
Partnership Against Terrorism (C-TPAT). C-TPAT is a program of CBP
(Customs and Border Protection), America's single unified border agency.
Mist Suppressant Protects Workers,
Plating Equipment – and Profits
Uyemura International Corp. has introduced an EPA-compliant
anti-mist that prevents vapor escape and minimizes evaporative
losses from chrome (Cr3 and CR5) plating baths.
Non-Mist L is a plating additive that forms a thin, strong foam
blanket that reduces surface tension, preventing the migration
of dangerous mists that can harm workers, equipment, and
ventilation systems. Non-Mist L also helps conserve costly
solutions by minimizing evaporative losses and drag-out.
Chromic acid concentrations are kept low, and waste
treatment costs are minimized.
Non Mist L is highly effective in small amounts, and there
is no negative effect on plating results. The product does
not contain PFOS* or fluorinated surfactants.
* perfluorooctane sulfonate
Technology Advances Produce Immediate
Productivity Gains for ENIG Processors
Uyemura (UIC), world Leader in electroless nickel/
immersion gold chemistries, has introduced 4 new process
improvement products. Each was created to deliver immediate
gains in product reliability, operational performance,
and cost control.
MNK-4 palladium catalyst is a chloride-free activator for
the electroless nickel plating of fine pattern PCBs. Two
operational advantages distinguish MNK-4. First, the product
eliminates the potential for bridging between pads. This is a
substantial advantage over conventional activators, which
often present bridging issues when fine patterns are plated.
MNK-4 also reduces costs, because it requires less-frequent
charging compared to other activators.
NPR-8 is an exceptionally robust electroless nickel base
plating chemistry. Highly stable in continuous use, it was
engineered for electroless nickel / gold plating to selective
PWBs with a dry film masking. As with Uyemura’s previous-
generation product, the mid-phosphorus content in the
deposited film remains constant regardless of MTOs
(metal turnovers). NPR-8 minimizes nickel corrosion,
and enhances performance when used with lead-free solders.
Deposited film is chemical corrosion resistant, particularly
against OSP chemicals and pretreatments.
TAM-55 is an advanced immersion gold bath for SMT that
optimizes gold thickness distribution. A primary advantage
is that it minimizes the possibility of black nickel. TAM-55
protects and maintains the solderability of the electroless
nickel in an ENIG deposit. It minimizes corrosion of the
underlying electroless nickel while producing a highly dense
gold film coating that improves the reliability of the solder joint.
This new immersion gold is ideal as a solderable finish for
small SMT and BGA pads.
Flexible, Lower Cost Alternative
Introduced for Lead Free Soldering
and Gold Wire Bonding
Uyemura (UIC), a global leader in ENIG chemistry,
has developed an ENEPIG (electroless nickel / electroless
palladium / immersion gold) technology that is a highly
cost-effective alternative to electroless nickel / electroless
gold or electrolytic nickel/ electrolytic gold processing for
high reliability gold wire bonding applications.
Talon is an electroless palladium bath that’s used as a
surface finish for electronic and PCB surfaces. Because it
is an electroless, rather than displacement process, it virtually
eliminates the potential of black pad. The bath is extremely
stable, and can be shut-down and re-started without difficulty.
Rate of deposition is highly stable throughout the bath life.
Using Talon, palladium can be deposited directly on copper
The Talon ENEPIG process is ideal for all lead-free soldering
or electroless nickel. The Talon film is solderable and aluminum
and gold wire bondable, and meets the technical requirements
of BGA bonding.
applications, particularly those involving high temperature
reflows. It is also an excellent choice when multiple reflow
applications are required.
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UYEMURA Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635
UYEMURA Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011
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