April, 2009 . . . Uyemura is proud to announce that it has become the first
manufacturer of plating chemistries, (in fact, one of the first
companies in the world) to be awarded ISO 9001:2008 certification,
with zero nonconformance items noted. We would like to recognize
the excellent work of everyone, in particular, David Liston, Quality
Manager, and Patricia Wolowicz, Tech Center Office Manager,
for their efforts in achieving this landmark distinction.
ISO 9001:2008 is a comprehensive Quality Management
System that requires a company to consistently provide product
that meets customer and regulatory requirements, and enhances
customer satisfaction through the effective application of the
system. Most notably, the ISO 9001-2008 quality system
assures Uyemura customers that Uyemura management is
committed to continuous improvement and customer satisfaction.
In bringing our quality system into conformance with
ISO 9001-2008 requirements, Uyemura trained a team of
in-house auditors representing all areas of the company,
who as a group are responsible for ongoing review of all
aspects of the quality system.
Uyemura is a company “powered by science, and focused
on customers.” We are dedicated to providing exceptional,
problem-solving finishing technology solutions that give
customers a defined and significant advantage in finishing
performance. And to helping them develop cost-saving
strategies that will enhance their productivity and
competitiveness in this challenging business climate.
April, 2008 . . .
Mist Suppressant Protects Workers,
Plating Equipment – and Profits
April, 2008. Uyemura International Corp. has introduced an
EPA-compliant anti-mist that prevents vapor escape and minimizes
evaporative losses from chrome (Cr3 and CR5) plating baths.
Non-Mist L is a plating additive that forms a thin, strong foam
blanket that reduces surface tension, preventing the migration
of dangerous mists that can harm workers, equipment, and
ventilation systems. Non-Mist L also helps conserve costly
solutions by minimizing evaporative losses and drag-out.
Chromic acid concentrations are kept low, and waste
treatment costs are minimized.
Non Mist L is highly effective in small amounts, and there
is no negative effect on plating results. The product does
not contain PFOS* or fluorinated surfactants.
* perfluorooctane sulfonate
March, 2008 . . .
Technology Advances Produce Immediate
Productivity Gains for ENIG Processors
IPC 2008. Uyemura (UIC), world Leader in electroless nickel/
immersion gold chemistries, has introduced 4 new process
improvement products. Each was created to deliver immediate
gains in product reliability, operational performance,
and cost control.
MNK-4 palladium catalyst is a chloride-free activator for
the electroless nickel plating of fine pattern PCBs. Two
operational advantages distinguish MNK-4. First, the product
eliminates the potential for bridging between pads. This is a
substantial advantage over conventional activators, which
often present bridging issues when fine patterns are plated.
MNK-4 also reduces costs, because it requires less-frequent
charging compared to other activators.
NPR-8 is an exceptionally robust electroless nickel base
plating chemistry. Highly stable in continuous use, it was
engineered for electroless nickel / gold plating to selective
PWBs with a dry film masking. As with Uyemura’s previous-
generation product, the mid-phosphorus content in the
deposited film remains constant regardless of MTOs
(metal turnovers). NPR-8 minimizes nickel corrosion,
and enhances performance when used with lead-free solders.
Deposited film is chemical corrosion resistant, particularly
against OSP chemicals and pretreatments.
TAM-55 is an advanced immersion gold bath for SMT that
optimizes gold thickness distribution. A primary advantage
is that it minimizes the possibility of black nickel. TAM-55
protects and maintains the solderability of the electroless
nickel in an ENIG deposit. It minimizes corrosion of the
underlying electroless nickel while producing a highly dense
gold film coating that improves the reliability of the solder joint.
This new immersion gold is ideal as a solderable finish for
small SMT and BGA pads.
March, 2008 . . .
Flexible, Lower Cost Alternative Introduced for
Lead Free Soldering and Gold Wire Bonding
IPC 2008. Uyemura (UIC), a global leader in ENIG chemistry,
has developed an ENEPIG (electroless nickel / electroless
palladium / immersion gold) technology that is a highly
cost-effective alternative to electroless nickel / electroless
gold or electrolytic nickel/ electrolytic gold processing for
high reliability gold wire bonding applications.
Talon is an electroless palladium bath that’s used as a
surface finish for electronic and PCB surfaces. Because it
is an electroless, rather than displacement process, it virtually
eliminates the potential of black pad. The bath is extremely
stable, and can be shut-down and re-started without difficulty.
Rate of deposition is highly stable throughout the bath life.
Using Talon, palladium can be deposited directly on copper
or electroless nickel. The Talon film is solderable and aluminum
and gold wire bondable, and meets the technical requirements
of BGA bonding.
The Talon ENEPIG process is ideal for all lead-free soldering
applications, particularly those involving high temperature
reflows. It is also an excellent choice when multiple reflow
applications are required.
August, 2007 . . .
New Electroless Nickel Technology for Aluminum Plating
is Lead-Free, CAD-Free, Peel-Free . . . and Strike-Free
August, 2007. Uyemura has introduced ANP, an electroless
nickel technology engineered to improve plating onto aluminum.
Plating electroless nickel on aluminum has been problematic
and costly due to short bath life. A normal EN bath can plate
steel for six to eight MTOs (36 - 48 g/l nickel plated). Plating
onto aluminum reduces that bath life by about 50%. The
typical failure is poor adhesion of the nickel to the aluminum,
resulting in blisters or nickel peel when the aluminum is bent.
Technology developed to address this problem of short bath
life used an alkaline nickel strike after zincating and prior to
the regular plating bath. Drawbacks to that approach include
extra tanks, process steps, and control over an additional plating
bath. Failures have also been seen with nickel-to-nickel bonding.
A further application-specific problem is that strike baths
always deposit magnetic nickel, thereby limiting their use
to applications where magnetism is not a factor.
Uyemura’s aluminum plating provides excellent aluminum
adhesion through at least six MTOs. The process does not
employ a strike and
adds no additional steps compared to normal aluminum
preparation double zincating.
This important new development uses Uyemura’s lead and
cadmium-free electroless nickel product in concert with
proprietary cleaning, etching and zincating technologies.
September, 2007 . . .
Black Nickel Technology Preserves Brightness,
Improves Durability
Sur/Fin, 2007. Uyemura, a leading provider of ultra-black
finishes, has introduced Nickstar, an advanced black nickel
technology that deposits a thin, and highly uniform over-coat
of black nickel-zinc alloy, preserving the substrate’s brightness
while producing an exceptionally rich black nickel finish.
Nickstar is a lustrous, and highly versatile plated black nickel.
A deposit thickness up to 2 microns can be achieved with
rack or barrel applications. If a thicker deposit – or very high
corrosion performance – is desired, a heavy nickel undercoat
can be used. Greater hardness can be achieved easily with
an optional salt additive. Color density, from darkest black
to softer hues, can be modified easily using a hull cell. A
distinctively elegant appearance can be produced when
Nickstar black nickel is dual-toned with UIC satin nickel.
Nickstar black nickel is well-suited for automotive interiors
and upscale sporting goods, where it diminishes glare and
improves durability. It is also ideal for hardware, plumbing,
architectural and other decorative uses.
June, 2006 . . . TH Technology is now representing Uyemura products in
Oregon and Washington. Headquartered in Aloha, Oregon,
a suburb of Portland, the company is owned by Tom Sawyer,
whose technical and applications expertise is well-known
throughout the plating industry. TH Technology is responsible
for the very successful implementation of Uyemura
immersion silver technology at Circuit Services Worldwide,
a full-service circuit board fabricator with manufacturing
facilities in Bellevue, WA, as well as Taiwan and China. November, 2005 . . . In recognition of years of mutual cooperation and success,
Uyemura International Corporation and Umicore-Galvanotechnik
GMBH have signed a new multi-year sales agreement covering
the North American market. As in the past, it again gives UIC
(Ontario, CA and Southington, CT) exclusive sales rights to GT’s electroplating products in the U.S and Canadian markets — plus
expands the agreement to allow non-exclusive coverage in Mexico.
GT is the manufacturer of the world famous Auruna, Arguna,
Rhoduna, Miralloy and other plating chemistries — plus their
technology leading platinized anodes. November, 2005 . . . Uyemura-USA (UIC) – Ontario, CA/Southington, CT is pleased
to announce an agreement with Matrix USA INC – Santa Ana, CA
whereby Matrix will sell Uyemura, UmicoreGT and MEC chemistries
to Matrix's customer base in CA, UT, NM, NV, AZ, OR, WA—plus
Baja, CA and British Columbia . UIC's sales and service group
will support Matrix's efforts and customers. This agreement enhances UIC's ability to continue its dramatic
growth for final finishes, especially electroless nickel/ immersion
gold, electroless gold, immersion silver and tin processes, plus the
quickly growing EPL and ETN acid copper business – GT’s world-
famous Auruna electroplating gold processes – plus the MEC
copper etching processes. 
BACK / HOME / ABOUT US / CONTACT UYEMURA Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635 UYEMURA Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011
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