Electroless Gold, Miralloy, Tin Nickel Plating and More!
– are available for various requirements related to
– most likely the
widest used electroless gold in the
process has been widely used in North
for more than 16 years. It is the most stable
gold chemistry known.
– the most sophisticated platinized
anodes available. Typical anodes are
(leaving micro-pores) or clad (leaving
micro-cracks). With the
aggressive nature of gold or rhodium
to shorten the
anode’s life, these anodes are plated using
a unique molten platinum
method – thus avoiding cracks
and pores and extending service life.
are available in a combination of
mesh sizes, platinum
thicknesses, and single or double-sided coatings.
– About 20% of the world’s
population has a skin
reaction to nickel metal. The longer
this metal is in contact with the
person’s skin, the more likely
they are to experience a burn –
worsens as the contact continues.
The perfect alternative is
Miralloy – an electroplating alloy
combination of tin, copper, zinc.
It is used
world-wide for zippers, buttons, bra clasps, and is sometimes
referred to as “white
bronze”. It doesn’t
tarnish and stands up well to
washing/drying. This process is also available in a
white version – the most commonly used variation plated
in North America.
Miralloy also has
gained wide acceptance for plating
connectors, as a replacement
for silver (it is tarnish-free) and as a
palladium (due to lower
cost). It is available in rack
or barrel versions.
SN1 Tin-nickel Plating Process - provides a bright, durable finish with a distinctive reddish layer that's ideal for decorative applications. Plating over bright nickel or satin nickel creates a distinctively warm appearance; no top-coating needed. Corrosion protection is superior to general tin-cobalt plating. SN1 has excellent bath stability for highest color consistency, and excellent throwing power, too, so it's applicable to rack and barrel plating.
|Umicore Electrolytic Palladium 457
– is suitable for decorative
and electronic applications. Slightly alkaline (7.7 pH) palladium electrolyte
produces high-gloss, low-porosity coatings that are bendable and crack-free,
up to 3 μm. Excellent corrosion resistance; stable electrolyte has a wide
operating range of current density. Compatible with rack and barrel
application; ideal for wire connectors, wire leads, automotive engine
components and decorative parts, cabinet hardware, military equipment,
printed circuit boards
Non Mist-L Plating Anti-mist Additive is an anti-mist
additive for chromium platers that is EPA-compliant. This anti-mist
additive forms a strong foam blanket that reduces the bath’s surface
tension, preventing the migration of dangerous mists. Non Mist L also
conserves plating solutions by minimizing evaporative losses and
drag-out. Chromic acid concentrations in the plating bath are kept
low and so is waste treatment.
Non Mist L plating anti-mist additive is highly effective in small amounts,
and has no negative effects on plating. It has desirable break-down
characteristics and won’t produce excessive foam. It is an excellent
product for improving shop environmental conditions and protecting
workers and equipment from chromium mist pollution.
TD – from the
developers of Rhodium J-1 and J-2,
the new TD version produces the whitest,
brightest, most reflective
rhodium plating available.
Nickstar Black Nickel –
Nickstar – a decorative black nickel
technology that deposits a thin, and highly uniform over-coat of black
nickel-zinc alloy, preserving the substrate's brightness and
producing an exceptionally rich black nickel finish.
– the highest throw electrolytic
nickel process available,
now used in many diverse industry
– electrolytic nickel-phos systems
that can replace gold
plating for some electronic connectors
due to its exceptional
corrosion resistance. These processes
are available in reel-reel
(Niphos 965) and rack/barrel/vibratory
(Niphos 966) formulations.
– tin/zinc alloy process that
produces 80/20 or 70/30
alloys. Good distribution, weldability
and solderability; provides
excellent corrosion protection for
iron and iron alloys.
RIP Au-II – widely
used process for stripping gold from
plated parts, at room temperature.
The most widely used process at
and platers throughout North America.
Rip Palladium Additive
– this economical step allows
the above process to easily convert
to a palladium stripper.
TD, J-1, J-2, Niphos, Dialloy, Electrolytic Palladium 457, Miralloy and Trialloy are trademarked products of Umicore-GT;
all other products
are from Uyemura.
Uyemura supplies electroless gold plating, electroless gold, Rhodium TD, tin zinc,
Copia gold stripper, Copia palladium stripper,
KTY electroless nickel, Dialloy tin zinc,
Niphos electrolytic nickel phos, ANP electroless
nickel plating for aluminum,
electrolytic palladium, and Non Mist L plating anti-mist additive.
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011
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