Uyemura Products

Acid Copper DC Electroplate
ACL-634 Acid Through-hole Cleaner for ENIG
Alkaline Copper
Anode Technology
ANP Electroless Nickel Plating for Aluminum
Antitarnish 616 PLUS
AuBel Electroless Gold (GMF)
AuBel Electroless Gold (Ceramic Substrates)
Auruna®
Auruna® Gold Plating
Auruna® Gold Processes

BEL-801 Electroless Nickel
Black Ruthenium
Cleaners for Final Finish
Cleaners for Plating
CL Satin Nickel
CL-NC Alkaline Copper
CL SNI Tin-Nickel Plating Process
Conformal Coatings
Copkia RIP Au-II
Copkia Rip Palladium Additive
Copper Gobbler™

Dialloy (GMF)
Dialloy (Automotive)
DIG Direct Immersion Gold on Copper
Electroless Nickel (Also see ANP, above, and NBB and KTY, below)
Electroless Nickel for wafer plating
Electrolytic Palladium
Electrolytic Plating System
Electrolytic tin for ceramics
Electrolytic tin for tin whiskers control
ENAG (Electroless Nickel Autocatalytic Gold)
ENEG
ENEPIG
ENIG
Epithas Ni/Au for Aluminum
Epithas Ni/Au for Copper
Final Finishes
Flip Chip Finishes
GRX-70 high-speed electrolytic process

Immersion Tin
Immersion Tin for Press Fit Connectors
Immersion Silver
Immersion Gold (TAM-55)
KAT (ENIG)

KAT GW (Electroless Gold)
KAT SP (Selective Plate)
KTY Electroless Nickel
MEC CT-910
MEC CZ-2030
MEC CZ-5480
MEC COPPERSEAL
MEC ETCHBOND
MEC FlatBOND GT
MECSEAL CL-5018
MEC V-BOND

Miralloy® (Connector)
Miralloy® 2851
Miralloy® (Apparel)
Miralloy® (Jewelry)
MMO Anode
MNK Palladium Catalyst
Nanofics Conformal Coating
NBB Electroless Nickel (GMF)
NBB Electroless Nickel (Automotive)
Nickstar
Nimuden NPR-4
Nimuden NPR-8
Niphos (Connector)
Niphos (GMF)
Niphos (Automotive)
Non Mist L plating anti-mist additive
NTB 302 electrolytic tin
OSP (Selective OSP / ENIG)

PCB Finishes
Plasma Coating Equipment
Plasma Coating
Platinode
Pre-Treatment for Electroless Plating of Metallized Ceramics
PRESA RGA-14 Immersion Silver
PRESA RMK-25 Immersion Tin
Rhodium TD (GMF)
Rhodium TD (Jewelry)
Satin Nickel
STARLiNE-DASH Electroless Nickel Plating Control
Stripping Solutions
Surface Treatment (MEC)
Synergy Anodes for Acid Copper Plating

Talon Electroless / Autocatalytic Palladium for ENEPIG
TAM-55 Immersion Gold Bath
TAW-66
Tin Nickel Plating Process
Thru-Cup AC-90 (single component)
Thru-Cup EPL (high throw)
Thru-Cup ETN (high current density)
Thru-Cup EVF-N (acid copper via fill)
Thru-Cup EVF-R (DC via fill)
Thru-Cup EVF-T (DC via fill for blind vias and thru-holes)
Thru-Nic
Thru-Nic CL
Trialloy® Tin-Zinc-Cobalt alloys
Tin Whiskers Elimination (GRX-70)
UBM - Aluminum
UBM - Copper
UBM - CMOS compatible
Umicore Electrolytic Palladium 457

 


UYEMURA Corporate Headquarters:

3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

 

 

   
   
Semiconductor Finishes:  
   
General Metal Finishes:  
 
   
   

 

Uyemura:
World Leader in PCB Plating Performance!