Uyemura Products

Acid Copper DC Electroplate
ACL-634 Acid Through-hole Cleaner for ENIG
Alkaline Copper
ANP Electroless Nickel Plating for Aluminum
AuBel Electroless Gold (GMF)
AuBel Electroless Gold (Ceramic Substrates)
Auruna® 526
Auruna® 8100
Auruna® Gold Plating
Auruna® Gold Processes

BEL-801 Electroless Nickel
Black Ruthenium
Cleaners for Final Finish
Cleaners for Plating
CL Satin Nickel
CL-NC Alkaline Copper
CL SNI Tin-Nickel Plating Process
Copkia RIP Au-II
Copkia Rip Palladium Additive
Copper Gobbler™

Dialloy (GMF)
Dialloy (Automotive)
DIG Direct Immersion Gold on Copper
Electroless Nickel (Also see ANP, above, and NBB and KTY, below)
Electroless Nickel for wafer plating
Electrolytic Nickel Gold
Electrolytic Palladium
Electrolytic Plating System
Electrolytic tin for ceramics
Electrolytic tin for tin whiskers control
ENAG (Electroless Nickel Autocatalytic Gold)
ENEG
ENEPIG
ENIG
Epithas Ni/Au for Aluminum
Epithas Ni/Au for Copper
Final Finishes
Flip Chip Finishes
GRX-70 high-speed electrolytic process
HASL Alternative Products

Immersion Tin
Immersion Silver
Immersion Gold (TAM-55)
KAT (ENIG)
KAT GW (Electroless Gold)
KAT SP (Selective Plate)
KTY Electroless Nickel (GMF)
KTY Electroless Nickel (Automotive)
MEC CT-910
MEC CZ-2030
MEC CZ-5480
MEC COPPERSEAL
MEC ETCHBOND
MEC FlatBOND GT
MEC V-BOND