Uyemura – our central research
labs in Hirakata (a suburb of Osaka,
Japan) have over 70 full time R&D
professionals dedicated exclusively
to the development and optimization
of functional and decorative plating
chemistries.

Our Taiwan company has nearly a dozen additional R&D
professionals assigned to new product development.

Uyemura also has R&D centers in China and Malaysia; the latter has
been responsible for groundbreaking work in general metal finishing.

Some of the industry's most important recent developments in nickel
technology have been Nickstar decorative black nickel, ANP Electroless
Nickel Plating for Aluminum, and ANP1012. The latter is a lead-free RoHS
product that enables plating of nickel phos alloys in the range of 10-12
weight percent phosphorus. All 3 of these were developed by the
Uyemura USA facility in Southington, CT, which is proudly
commemorating its 13th year of service to industry.

What Are Our Newest Developments?

Uyemura GRX-70 high-speed electrolytic process:
the 22,000-hour solution to tin whisker formation.

Uyemura ANP Electroless Nickel Plating for Aluminum –
an important new technology that uses Uyemura’s lead and
cadmium-free electroless nickel product with proprietary
cleaning, etching and zincating technologies to deliver
excellent adhesion through six or more MTOs.

Presa RMK-30 Immersion Tin – for PWB and PKG – a fluoride-free
immersion tin that provides excellent solderability – even with
high-temp, lead-free solders.

MEC Company LTD – an Osaka company providing Uyemura customers
access to 35 more R&D professionals specializing in products for
the printed circuit and semiconductor industries. Most recently, Uyemura
announced the commercial availability of MEC FlatBOND GT copper surface treatment. Click here for details.

Umicore-GT – their Schwbisch Gmund, Germany facility
benefits Uyemura customers with access to a team of 35 R&D
professionals. This team is credited with the development
of industry-leading processes for electroplating gold, silver,
rhodium, ruthenium and decorative plating — as well as the
non-precious Miralloy,Dialloy, and Niphos chemistries.
Also among their credentials is the development of
revolutionary Platinode anodes.

CL Technology – this Solingen, Germany company provides
Uyemura-USA customers with access to the world’s most advanced
and efficient decorative plating chemistries. CL Technologies' satin
nickel is a market leader in the U.S. and we expect their SN1
tin-nickel process to do equally well.

New Surface Technologies – this Bedford, OH company offers
the latest in zinc, chromates and other decorative plating processes.

RBP Chemical Company – based in Milwaukee, WI, this firm
produces tin and solder strippers as well as mist suppressors and
multiple cleaners used in the printed circuit industry.

Network Electronic Marketing – Phoenix, AZ provides the
EZ-Plate technology that is revolutionizing acid copper plating in
the printed circuit industry. EZ-Plate lowers costs while
providing higher quality finished product.