Uyemura – our central research
labs in Hirakata (a suburb of Osaka,
Japan) have over 70 full time R&D
professionals dedicated exclusively
to the development and optimization
of functional and decorative plating
chemistries.

Our Taiwan company has nearly a dozen additional R&D
professionals assigned to new product development. Uyemura-USA
opened its Southington, CT facility in 1999, becoming the third facility
focused on product innovation.

What’s Our Newest Development?

Uyemura ANP Electroless Nickel Plating for Aluminum –
an important new technology that uses Uyemura’s lead and
cadmium-free electroless nickel product with proprietary
cleaning, etching and zincating technologies to deliver
excellent adhesion through six or more MTOs.

Umicore-GT – their Schwbisch Gmund, Germany facility
benefits Uyemura customers with access to a team of 35 R&D
professionals. This team is credited with the development
of industry-leading processes for electroplating gold, silver,
rhodium, ruthenium and decorative plating — as well as the
non-precious Miralloy,Dialloy, and Niphos chemistries.
Also among their credentials is the development of
revolutionary Platinode anodes.

New Surface Technologies – this Bedford, OH company offers
the latest in zinc, chromates and other decorative plating processes.

RBP Chemical Company – based in Milwaukee, WI, this firm
produces tin and solder strippers as well as mist suppressors and
multiple cleaners used in the printed circuit industry.

Network Electronic Marketing – Phoenix, AZ provides the
EZ-Plate technology that is revolutionizing acid copper plating in
the printed circuit industry. EZ-Plate lowers costs while
providing higher quality finished product.