Uyemura: |
World
Leader |
in
Plating |
Performance |
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Uyemura
– our
central research
labs in Hirakata (a suburb of Osaka,
Japan) have over 70 full time R&D
professionals dedicated exclusively
to the development and optimization
of functional and decorative plating
chemistries.
Our Taiwan company has nearly a dozen
additional R&D
professionals assigned to new product
development. Uyemura-USA
opened
its Southington, CT facility in 1999, becoming the third facility
focused on product innovation.
What’s Our Newest Development?
Uyemura ANP Electroless Nickel Plating for Aluminum –
an important new technology that uses Uyemura’s lead and
cadmium-free electroless nickel product with proprietary
cleaning, etching and zincating technologies to deliver
excellent adhesion through six or more MTOs.
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MEC
– an Osaka
company providing Uyemura customers
access to 35 more R&D professionals specializing
in products for
the printed circuit and semiconductor
industries.
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Umicore-GT
– their
Schwbisch Gmund, Germany facility
benefits Uyemura customers with access
to a team of 35 R&D
professionals. This team is credited
with the development
of industry-leading processes for electroplating
gold, silver,
rhodium, ruthenium and decorative plating — as well
as the
non-precious Miralloy,Dialloy, and Niphos chemistries.
Also
among their credentials is the development of
revolutionary
Platinode anodes.
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CL
Technology –
this Solingen, Germany company provides
Uyemura-USA customers with access to
the world’s most advanced
and efficient decorative plating chemistries.
CL Technologies' satin
nickel is a market leader in the U.S.
and we expect their SN1
tin-nickel process to do equally well. |
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New
Surface Technologies
– this Bedford, OH company offers
the latest in zinc, chromates and
other decorative plating processes.
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RBP
Chemical Company –
based in Milwaukee, WI, this firm
produces tin and solder strippers
as well as mist suppressors and
multiple cleaners used in the printed
circuit industry.
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Network
Electronic Marketing
– Phoenix, AZ provides the
EZ-Plate technology that is revolutionizing
acid copper plating in
the printed circuit industry. EZ-Plate
lowers costs while
providing higher quality finished
product.
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Uyemura is dedicated to the development of high-performance functional plating,
and decorative plating.
Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635
Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011

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