Uyemura Final Finishes:
Immersion Silver, ENIG
for the PWB Industry,
HASL Alternative Products
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Final Finishes: ENIG, Immersion Silver, MORE
KAT
Electroless Nickel/ Immersion Gold process (ENIG)
is the industry standard for producing uniform mid-phos EN deposits with a
thin topcoat of immersion gold, over copper substrates. The finish is highly
resistant to corrosion, and is both solderable and aluminum wire bondable.
It is an ideal contacting surface.
KAT users never have to waste time with “dummy plating.” They also get:
- A low-concentration, room temperature, chloride-free catalyst
- A bath that runs at least 10°F below the competition
- Compatibility with all the new soldermasks
* Use with the STARLINE DASH Controller. This advanced electroless nickel
controller is self-cleaning and self calibrating. The controller modifies the
calibration curve to compensate for the accumulation of by-product throughout
the life of the bath. It maintains a complete analytical record for SPC charting.
MORE INFO
KAT has long been the highest-performing mid-phos electroless nickel. That, however, hasn’t stopped Uyemura chemists from making it better . . .
MNK-4 palladium catalyst is a new activator for electroless nickel plating
of fine pattern PCBs. While traditional activators often have bridging issues
when fine patterns are plated, MNK-4 eliminates the potential for bridging
between pads. Stable, chloride-free bath operates between 77-95°F;
immersion time is 1-3 minutes. Needs charging less often!
Nimuden NPR-8 is a mildly acidic electroless nickel -phosphorus process
engineered for electroless nickel / gold plating to selective PWBs with dry film
masking. The catalyst, electroless nickel, and immersion gold components
have all been improved for greater productivity, and bath life. The NPR-8 bath
is highly stable in continuous use, and the phosphorous content in the deposited
film remains constant regardless of metal turn-overs.
NPR-8 is chemical corrosion-resistant, especially against OSP treatment
chemicals, including pre-treatment, and is ideal with lead-free solders.
It is used with TAM 55 gold to produce the highest quality ENIG, with the
highest yields, available today.
TAM-55 advanced immersion gold bath minimizes nickel corrosion,
optimizes gold distribution. TAM-55 protects and maintains the solderability
of the electroless nickel in an ENIG deposit. It is ideally suited for use as a
solderable finish for small SMT and BGA pads. For maximum compatibility,
use Nimuden NPR Series electroless nickel as the underlying deposit for
both PWB and IC packaging.
Electroless Nickel, Electroless Palladium, Immersion Gold (ENEPIG)
ENEPIG is formed by the deposition of electroless nickel, followed by electroless palladium, with an immersion gold flash. ENEPIG has exceptionally wide application: it is suitable for soldering, gold wire bonding, aluminum wire bonding, and contact resistance.
RoHS requirements, and increased focus on package reliability, have heightened interest in ENEPIG, particularly as the industry evaluates its capabilities in lead-free assembly conditions. ENEPIG performance is stellar in forming highly robust solder joints with lead-free SAC-type alloys.
In extended solder joint life testing (150°C for up to 1,000 hours), shear ball tests indicate no loss of solder joint strength. SEM studies and elemental analysis shows that the presence of palladium at the joint interface dramatically reduces inter-metallic (IMC) propagation, making ENEPIG the leading choice finish for packages that require soldering and wire bonding, with lead-free SAC type alloys.
The ENEPIG process is an excellent solution for IC package PCB substrates, particularly ceramic-based SiP products. Unlike electrolytic processes, ENEPIG carries no requirement for bussing lines, a factor which translates to additional flexibility in the design of circuits, and allows higher-density designs.
Finally, ENEPIG is immune to the dreaded “black pad” problem. Palladium is plated onto the electroless nickel via chemical reduction as opposed to a displacement reaction, so there is no opportunity for compromise of the electroless nickel layer.
From a cost standpoint, the ENEPIG process is less expensive than electrolytic or electroless bondable gold. The savings can easily reach 80% for total final finishing cost by replacing electrolytic nickel gold processes with ENEPIG.
Talon electroless / auto-catalytic palladium for ENEPIG is economical, solderable, and wire-bondable on Al and Au. Stable bath has a low palladium
metal content and is highly stable. Deposition rate and quality of the
deposit remain highly consistent throughout the bath’s long life. The bath
accommodates shut-down and restart. Using Talon, palladium can
be deposited directly on a copper substrate or on electroless nickel.
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KAT UF (ENEPIG) Universal Finish
This unique Ni/Pd/Au surface finish is solderable, aluminum and gold wire
bondable, and a superb contact surface. The recommended thickness
is 3 – 5 microns (120 – 200 μins) of electroless nickel, 0.16 micron
(4 - 6 μins) of electroless palladium, and 0.02 to 0.04 micron (1 - 2 μins)
of immersion gold.
ENEPIG exhibits the highest degree of solder joint reliability of all available
finishes with lead-free SAC 305 alloy. The palladium slows the diffusion of Sn
into the Ni, resulting in a minimum thickening of the nickel/tin IMC,
even following 1000 hours at 150°C.
Note: ENEPIG isn't the first choice for Sn/Pb eutectic solder. The palladium
does not form intermetallics with Pb, and this results in a disrupted IMC layer
that may compromise the reliability of the solder joint. MORE INFO
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KAT SP
New ENIG for Selective Plating
This
is a modified KAT ENIG process designed
to accommodate the
processing needed for the selective
plating of ENIG and OSP (organic
solderability preservative).
The nickel bath
is sulfur-free and more corrosion
resistant. The gold
is a much tighter, lower porosity gold
coating.
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ENAG Electroless Nickel / Autocatalytic Gold
is a high-performing final finish for wire bondable deposits, and an
excellent alternative to immersion chemistry, or ENEPIG. Deposits
120-240 μins of nickel, 8-40 uins of electroless gold. Read “Neutral
Auto-Catalytic Electroless Gold Plating Process” in the Uyemura library.
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Copkia
Rip II Gold Stripper
Works at room
temperature to remove plated gold from
parts.
Copkia
Rip Palladium Additive
This component,
added to the above product, turns the
stripper into
the best available palladium stripper.
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PRESA RGA-SS-M5 Silver Stripper
Works at room temperature to remove / strip immersion silver from PWBs.
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KAT GW
Electroless Nickel with Electroless Gold for
gold wire bonding
In this process,
the standard ENIG deposit is followed
by an electroless
gold step. Here the gold thickness is
built up to meet the requirements
of “Gold Wire” bonding.
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Gobright-TMX
is a neutral pH electroless gold. |
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AuBEL is an alkaline
pH electroless gold process. |
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PRESA RGA-14
Immersion Silver ( View Animation Clip)
The requirements of newer electronic parts have caused PCBs to evolve and demand improved manufacturing methods. One important requirement is
high-density mounting. HASL exhibits poor thickness distribution and
cannot meet the needs of high-density mounting.
The recent emphasis on environmentally safer products has also advanced
the cause of eliminating lead. OSP’s formulations are not capable of preventing copper oxidation under the higher-temperature assembly conditions associated
with lead-free.
Uyemura's RGA Immersion Silver was developed to meet those challenges.
Process
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Immersion silver is a simple process, with silver directly displacing copper in an immersion reaction. RGA-14 is a high productivity process. |
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The RGA Immersion Silver process is compatible with horizontal conveyorized equipment. |
Properties
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The RGA Immersion Silver deposit is uniform
and meets thickness distribution
criteria. |
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Excellent shelf life with proper
packaging and storing conditions. |
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Ideal soldering surface under
eutectic and lead-free assembly
temperatures. |
Plating Bath
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The Immersion Silver plating
bath is very stable because the
reaction is displacement-type. |
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The RGA-14 bath
does not decompose with UV light. |
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Because it
is a low temperature process, RGA-14
does not attack the
substrate or the soldermask. |
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The immersion silver deposits
only on copper, and not on other
areas (such as can be seen with auto-catalytic baths). |
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PRESA RMK-30
Immersion Tin
Presa RMK-30 immersion tin produces a solderable surface finish for PWBs.
Solderability is excellent, even with high temperature, lead-free solders.
Tin is deposited only on the copper surface, via displacement. The tin deposit
maintains exceptional solderability, even after extended storage. The finish
is also compatible with eutectic solder, and meets the requirements of
press fit connections.
Advantages of Presa RMK-30:
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RMK-30 mitigates tin whiskers. |
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Solution is fluoride-free. |
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The simple four-step process has a relatively low operating temperature. |
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Bath performance is consistent through its service life. |
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It is compatible with most commercial soldermasks. |
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It provides superior thickness distribution. |
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It is an ideal surface for “lead-free” soldering applications. |
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RMK-30 is applicable with vertical and horizontal equipment. |
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DIG Direct
Immersion Gold on Copper
Electrolytic
Nickel Gold
Uyemura offers
a broad range of electrolytic
nickel processes;
sulfate, sulfamate and “High
Throw” electrolytic nickel. “Thru
–Nic” electrolytic
gold processes are available for hard or soft gold,
depending on customer requirements.
Uyemura offers
top of the line platinized
titanium anodes for
gold plating. The platinum is deposited
from a molten bath that avoids
micro-pores and micro-cracks found
in traditionally produced anodes.
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Stripping
Solutions
Solutions
for gold and silver stripping are also available from Uyemura. |
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Acid
Copper DC Electroplate
“Via filling”
connects the different layers in buildup technology (stacked
vias and
vias in pad) manufacturing. This improves the long-term
reliability
of the PCB and the package.
“Thru-Cup
EVF-R”
is a unique organic additive system,
which fills
blind vias with electroplated copper
using vertical plating equipment.
The additive components are readily
analyzed using CVS and Hull cell
techniques. The organic additives are
very stable and do not require
regeneration. Carbon treatment is recommended
at a frequency of
2000AH/L of bath (approximately annually). The ratios of the inorganic
components are different from
traditional acid copper plating.
The “Thru-Cup EVF-R” system
is based on DC rectification. It operates in
most existing equipment,
with “circular knife edge”
agitation and good
air sparging.
The system plates vias as small
as 30 microns and as large as 145
microns.
Plating occurs at 20 ASF for 60 to 90
minutes. Less time gives less than
0.5 mil on the surface. The process
has higher than average productivity
for this level of sophistication in
plating. MORE INFO on Acid Copper Plating.
“Thru-Cup
EVF-R” system advantages:
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High
productivity plating at 20 ASF
for less than 90 minutes |
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Produces minimum
(<15%) “Dimple”
and low surface thickness |
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Proven in production environment |
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No special
equipment needed |
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No need for
expensive, complex pulse plating
rectification |
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No regeneration |
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Carbon treatment
every 10-12 months.
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Now available: multi-functional EVF-T. While EVF-R fills blind vias,
EVF-T fills blind vias and plates through holes simultaneously.
Learn more |
Copper
Gobbler™
Copper Gobbler™ is a revolutionary
metallic copper dissolution
system
and a key component of the EZ
Plate System™.
Copper Gobbler™
dissolves pure copper chips
into sulfuric-acid-based
copper plating solutions. It
is a simpler, less-expensive
alternative
to systems which use copper
sulfate, copper oxide, or copper
phosphate
as the source to replenish copper
in non-soluble anode plating
baths.
Copper Gobbler™ is a trademark
of Optimum Process Technologies,
LLC.
MORE INFO
Features:
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Available
in 0 – 25 lb. per hour modules |
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Compact size |
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Simple to
operate |
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Heavy duty
construction |
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Utilizes inexpensive
scrap copper |
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Low initial
cost |
| EZ
Plate™ is a trademark of
Network Electronic Marketing,
Inc. |
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Anodes
for Acid Copper Plating
Synergy™
anodes are electrocatalyzed
titanium (mixed metal oxide)
anodes
for
plating Printed Wiring Boards. The Synergy anodes’ patented
coating
formulation operates
with industry standard plating additives while
improving
board plating characteristics.
Synergy anodes provide high
quality, long life performance
that
industry expects from ELTECH.
Synergy anodes are offered in
standard and custom fabricated
designs to
ensure optimum performance.
Performance Advantages:
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Improved
copper plating distribution |
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1:1 surface
to through-hole uniformity |
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Elimination
of nodules and surface sanding |
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Elimination
of anode sludge |
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Improved yield |
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Eliminates
tedious anode maintenance |
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Safer operation
with light weight titanium anodes |
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Operates at increased current density |
Synergy anodes improve straight
line throwing power. Copper plates
deep into high aspect ratio holes
and blind vias, producing 1:1
surface
to through hole plating distributions.
Synergy anode technology is
patent pending. Anodes
Protect Organic Additives -
Synergy anodes are formulated
to
protect your organic additives.
Operation with Synergy anodes
provides
additive consumption equivalent
to soluble anode experience.
Other Applications for Synergy
Anodes:
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Copper
foil production |
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Gravure
cylinder plating |
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Trivalent
chrome plating |
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Ni/zncl
balancing anode |
Commercial Experience - ”We
have commercially operated ELTECH’s
Synergy anodes in our PAL line
for 18+ months. The benefits that
we’ve
seen using Synergy anodes include
nodule-free boards, improved copper
plating distribution, increased
board throughput, ease of plating
operation
and reduced maintenance. Additionally,
we have operated with our traditional
bath chemistry, and observed no
additional brightener consumption,
compared
to soluble copper anodes.”
Gerard O’Brien
Director of Material Test, Reliability
and Technology
Photocircuits Corp.
Custom
Designed for Optimum Performance
– Each customer’s requirements
are evaluated and a system designed
to ensure optimum performance
in
surface distribution and throwing
power, with maximum efficiency
in product throughput, maintenance
and labor. MORE INFO
Synergy is a trademark of ELTECH Systems Corporation. |
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Thru-Cup
EPL
Thru-Cup EPL is a new “High Throwing
Power” acid copper additive
formulation for printed wiring board
plating applications. It is designed
for today's high aspect ratios with
fine lines circuitry. It has the simplicity of
DC plating with results
that can easily compete with the more
complex
waveforms of pulse plating.
The chemistry is very stable and does
not require continuous regeneration.
The process produces a fine-grained
equiaxed copper deposit. The
leveling capability of Thru-Cup EPL
overcomes irregularities on the
substrate surface and does not allow
nodule growth. The deposit is
bright and ductile with excellent elongation, tensile strength and
metallurgical properties. Thru-Cup EPL
can maintain these metallurgical
properties plating as low as 5 ASF (0.5
ASD) and as high as 25 ASF
(2.5ASD).
The Thru-Cup EPL is a two-component
system: the carrier controls
deposit thickness uniformity, and the
brightener is the grain-refining
additive. The solution components and
additives have a wide operating
window and are easily controlled by
standard analytical methods.
Thru-Cup EPL is compatible with both
air agitation and airless agitation
(Eductor). It is also compatible with
“EZ-PLATE”. EZ-PLATE is
a plating
system that uses insoluble anodes with
copper regeneration in a vertical
plating mode. The anodes are titanium
coated with iridium oxide and a
patented synergy coating. The copper
regeneration is a patented process
that utilizes the bath chemistry with
air sparging to dissolve copper
external to the plating cell. MORE INFO |
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Thru-Cup
ETN
Thru-Cup ETN
is a new acid copper additive formulation
for printed
wiring boards plating applications.
It is ideally suited for vertical
conveyorized lines where plating speed
is important. It is designed
for plating with current densities as
high as 40 ASF or 4.0 ASD. It
has the simplicity of DC plating with
results that can easily compete
with the more complex waveforms of pulse
plating. The chemistry
is very stable and does not require
continuous regeneration.
The process produces a fine-grained
equiaxed copper deposit. The
leveling capability of Thru-Cup ETN
overcomes irregularities on the
substrate surface and does not allow
nodule growth. The deposit is
bright and ductile, with excellent elongation, tensile strength and
metallurgical properties.
The Thru-Cup ETN is a two-component
system. The carrier controls
deposit thickness uniformity, and the
brightener is the grain-refining
additive. The solution components and
additives have a wide operating
window and are easily controlled by
standard analytical methods.
Thru-Cup ETN is compatible with both
air agitation and airless agitation
(Eductor). It is also compatible with
“EZ-PLATE”. EZ-PLATE is
a plating
system that uses insoluble anodes with
copper regeneration in a vertical
plating mode. The anodes are titanium
coated with iridium oxide and
a patented synergy coating. The copper
regeneration is a patented
process that utilizes the bath chemistry
with air sparging to dissolve
copper external to the plating cell. MORE INFO |
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Thru-Cup
AC-90
Thru-cup AC-90
is a single-component acid copper additive
system
designed for simplicity of use. It is a mixture of carrier and
brightener that has a wide operating
window for general-purpose
plating. The additives are mixed in
the proper ratio for use as a
single component system. MORE INFO |
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MEC
Surface Treatment
(Copper micro-roughening for adhesion)
MEC products are formulated for maximum
copper roughening, topography
for organic adhesion, and replace mechanical or pumice scrubbing. The
degree of roughening
is easily controlled to create the proper surface for
the specific application.
In the case of horizontal conveyorized equipment,
it is simply
a matter of controlling the conveyor speed.
Minimum roughening for dry film adhesion promotes superior film
adhesion that is required for fine line
circuits of inner core material.
This degree of roughening allows for
clean developing and for complete
resist stripping after circuitization.
Moderate roughening is ideally suited
for surface preparation before
soldermask adhesion. This is particularly
important to anchor soldermask
dams as low as 1.0 mil thick and to
prevent chemical seepage under
the mask during final finish deposition.
Maximum roughening is needed for inner
layer adhesion.
These products replace oxide
treatment of the copper.
Used for this purpose, the process is completed
with the
application of an anti-tarnish adhesion promoter.
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EtchBOND
CT-910
• Soldermask adhesion promoter
• Copper adhesion promoter
• Electrolytic copper plated adhesion promoter
This formic acid-based process is a simple and fully-conveyorized microetching process that replaces conventional pumice treatment, also aluminum oxide, peroxide sulfurics and persulfates. EtchBOND delivers the highest level of roughening, and substantially improves soldermask and dry film adhesion. Used in conjunction with CL-8301 adhesion promoter, it is the first choice for oxide replacement for inner layer lamination. Dwell time may be reduced for copper surface preparation for soldermask adhesion and/or dry film application.
The microporous copper surface topography created by CT-910 produces s/m or d/f adhesion that exceeds conventional pumice treatment without particle problems. This product produces the highest peel strength available, and is exceptional on electrolytic copper plated innerlayers. Apply in horizontal conveyorized mode.
EtchBOND CT-910 process treated copper surface (left)
EtchBOND CT-910 process treated copper conductor (right)
EtchBOND for Soldermask
- No exposed copper after HAL
- No skips / no blisters
- No solder mask voids
EtchBOND for Dry Films
- Achieves fine line resolution
- Best topography for HDI
- Best process for flexible circuits
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EtchBOND
CZ-5480
This nitric
acid based formulation is primarily used
for
copper micro roughening for dry film and soldermask
applications.
Apply in horizontal conveyorized mode. |
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Electrolytic Palladium
Umicore Electrolytic Palladium 457 is a lightly alkaline (7.7 ph) palladium electrolyte that produces low-porosity coatings that are bendable, crack-free,
up to 3 μm. Stable electrolyte has a wide operating range. Compatible with
rack and barrel application; ideal for wire connectors, wire leads,
printed circuit boards.
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Uyemura PWB finishes lead the world in plating performance.
Products include final finishes, acid copper DC electroplate,
ENIG, gold wire bonding, electrolytic nickel gold, immersion silver
and immersion tin. Also, Electrolytic Palladium, and Copper Gobbler,
a metallic copper dissolution system central to the
EZ Plate System.
UYEMURA Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635
UYEMURA Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011
© Copyright 2010.
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