"Powered by science, focused on customers."

Uyemura provides exceptional, problem-solving finishing technology solutions, including the
broadest range of PCB finishes, ENIG, ENEPIG, ENAG, and much more.

 

Technology

EPIG nickel-free PCB finish

EPIG nickel-free PCB finish is gold wire bondable, solderable, ideal for HF use

EPIG (Electroless Palladium, Immersion Gold) from Uyemura has opened up a wide, new design avenue for high frequency applications and designs with reduced spacing. The EPIG process deposits palladium directly onto copper. More

EVF-N DC Via Fill
Thru-Cup EVF-N plates copper in through-holes and blind vias, cutting process time 50%. It delivers exceptional performance for blind via diameters smaller than 150 micrometers.

TAM-55 advanced immersion gold bath

TAM-55 advanced immersion gold bath minimizes nickel corrosion, optimizes gold distribution; the ultimate gold for ENIG and ENEPIG. More

 

IPC Award Honors UIC


The IPC Peter Sarmanian Corporate Recognition Award honors an IPC member company for significant contributions to the PCB industry. The 2017 award was presented to Uyemura USA President Tony Revier by IPC President John Mitchell during IPC APEX on February 14. The award was established in 2007; this is the 2nd time Uyemura has been so honored. The award is named for former IPC Board Chairman Peter Sarmanian. Recent honorees included Honeywell, Raytheon and Lockheed Martin. More News


 

 


UYEMURA Corporate Headquarters:

3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

 

   
   
Semiconductor Finishes:  
   
General Metal Finishes:  
 
   
   

 

George Milad
honored by SMTA more

 

See us at Booth 331
June 19-21