EPIG nickel-free PCB finish is gold wire bondable, solderable, ideal for HF use
EPIG (Electroless Palladium, Immersion Gold) from Uyemura has opened up a wide, new design avenue for high frequency applications and designs with reduced spacing. The EPIG process deposits palladium directly onto copper. More
Industry’s deepest black finish, with exceptional hardness and high density topography. An entirely new film “shape” with extraordinary micro-uniformity and corrosion resistance.
TAM-55 advanced immersion gold bath minimizes nickel corrosion, optimizes gold distribution; the ultimate gold for ENIG and ENEPIG. More
The IPC Peter Sarmanian Corporate Recognition Award honors an IPC member company for significant contributions to the PCB industry. The 2017 award was presented to Uyemura USA President Tony Revier by IPC President John Mitchell during IPC APEX on February 14. The award was established in 2007; this is the 2nd time Uyemura has been so honored. The award is named for former IPC Board Chairman Peter Sarmanian. Recent honorees included Honeywell, Raytheon and Lockheed Martin. More News