"Powered by science, focused on customers."

Uyemura provides exceptional, problem-solving finishing technology solutions, including the
broadest range of PCB finishes, ENIG, ENEPIG, ENAG, and much more.



UIC’s ENEPIG process is the ultimate solution for IC package PCB substrates, particularly ceramic-based SiP products.

ENEPIG’s pd plates via chemical reduction, so there’s no opportunity for EN layer compromise. UIC ENEPIG helps prevent BGA fractures, can replace the SIT used for HDI cellular phone PCBs.

Pure Palladium vs.

Uyemura supplies both.
Each customer is unique,
so we recommend
solutions based solely on
your application.
Read about Pd vs. PdP

EVF-N DC Via Fill
Thru-Cup EVF-N plates copper
in through-holes and blind
vias simultaneously, cutting
process time by 50%. It
delivers exceptional perfor-
mance for blind via diameters
smaller than 150 micrometers.


UIC Strengthens Western Field Team With Veteran PCB Experts

Uyemura USA has intensified its service capacity in the west and
southwest with the additions of DX Tech Solutions and S1 Technology
to its field service team. more



UYEMURA Corporate Headquarters:

3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635


Semiconductor Finishes:  
General Metal Finishes:  


Uyemura congratulates Alex Stepinski, the first recipient of
I-Connect007’s Good for the Industry Award. more


George Milad, UIC
National Accounts Manager for Technology and IPC Plating Committee Chair, addresses NASF/AESF, PCB West, SMTAI