Semiconductor Industry:
General Metal Finishing

World leader in
Nickel Technologies

Electroless Nickel

NBB Electroless Nickel – this process is bright
and robust despite being free of lead and cadmium.
It is a mid-phos electroless nickel process
in the range of 6 to 8.

KTY Electroless Nickel – from the research labs of Uyemura-Japan,
this process is the world’s first “heavy metal –free” electroless nickel. Lead, cadmium and other heavy metals traditionally used for adding brightness and stability have been eliminated.

ACL-634 is a new through-hole cleaner for electroless nickel / immersion gold.
This acid-type soaking cleaner is well suited for the pretreatment in electroless
Ni/Au processes with NPT (Non-Plating Through Hole). ACL-634 removes palladium
from NPTH, will not damage permanent resist, and rinses well with water.

Electroless Nickel Plating on Aluminum

ANP Electroless Nickel Plating for Aluminum – substantially
improves plating onto aluminum. Plating electroless nickel on aluminum
has been problematic and costly due to short bath life.  A normal EN bath
can plate steel for six to eight MTOs (36 - 48 g/l nickel plated). Plating
onto aluminum reduces that bath life by about 50%. The typical failure
is poor adhesion of the nickel to the aluminum, resulting in blisters or
nickel peel when the aluminum is bent.
Technology developed to address this problem of short bath life used
an alkaline nickel strike after zincating and prior to the regular plating
bath. Drawbacks to that approach include extra tanks, process steps,
and control over an additional plating bath. Failures have also been
seen with nickel-to-nickel bonding.
A further application-specific problem is that strike baths always
deposit magnetic nickel, thereby limiting their use to applications
where magnetism is not a factor.
Uyemura’s electroless nickel plating for aluminum provides excellent
adhesion through at least six MTOs. The process does not employ a
strike and adds no additional steps compared to normal aluminum
preparation double zincating. 
This important new development uses Uyemura’s lead and
cadmium-free electroless nickel product in concert with proprietary
cleaning, etching and zincating technologies.

ANP1012 electroless nickel plates nickel phosphorus alloys in the range of 10-12 weight percent phosphorus. It's ideal for applications requiring:

  • A high degree of corrosion resistance
  • A non-magnetic nickel finish
  • Excellent wear resistance and a low contact friction finish

ANP1012 has excellent capacity to plate aluminum alloys with good adhesion using conventional zincate pretreatment practice.

ANP and ANP1012 electroless nickel processes are RoHS compatible. They were developed by the Uyemura Tech Center, Southington, CT.

Uyemura: A World Leader in Electroless Nickel and Electroless Nickel Plating on Aluminum.

Alkaline copper, ENIG electroless nickel / immersion gold plating and immersion silver plating, EN plating on aluminum by Uyemura

UYEMURA Corporate Headquarters:

3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

UYEMURA Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011

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