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MEC from Uyemura - The Roadmap for High Density & Ultra High Density Circuits.
MEC from Uyemura -The Roadmap for High Density & Ultra High Density Circuits.

Uyemura’s Mission is creating and delivering practical solutions to the competitive, operational and environmental challenges our customers face. Together with MEC, we establish new benchmarks for performance, reliability and cost management.

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Article on Quality and continuous improvement
Next-generation RAIG Process

Paper evaluates a novel RAIG formulation using a non-hazardous stabilizer without compromising performance. Novel RAIG electrolyte eliminated gold plate-out, provided excellent deposit uniformity for ENIG and ENEPIG, had corrosion product ratings of zero per IPC-4552B.

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Gobright TWX-42 Reduction-Assisted Immersion Gold
TWX-42 Flyer

Gobright® TWX-42 RAIG® (Reduction-assisted Immersion Gold) can produce significantly thicker gold deposits than standard immersion golds. It is an environmentally favored process for ENIG, ENEPIG, and EPIG, a 5th generation “mixed reaction” gold. Displacement initially occurs on the nickel surface; an autocatalytic reaction prevents nickel corrosion.

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IC Substrates Epithas Platform
IC Substrates Flyer

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Article on Assessing Data Independence and Normality for SPC Charts
Assessing Data Independence and Normality for Statistical Process Control Charts

Data independence and normality are underlying crucial assumptions for SPC charts. Understanding how to evaluate these two before charting data is critical. Methods for checking data independence and normality are reviewed and supported with examples.

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From Finsihing and Coatings: Rich Depoto on Improved Finishing Options Powering EV Battery Demand
Improved Finishing Options Power EV Battery Demand

Rich DePoto explores EV battery manufacturing challenges in an article published by Finishing & Coating. Among Uyemura lab’s high-priority projects: achieving good adhesion of platinum to titanium while building uniform thickness.

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Article on Statistical Process Control Charts
Statistical Process Control Charts: Sampling Frequency, Subgroups, and Plans

SPC charts are powerful tools, but determining the appropriate data collection parameters is challenging. Regular review of control chart limits enhances continuous improvement efforts.

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Article on Cpk or Ppk
Cpk or Ppk? A Look at Using Both Capability Indices

In pursuing quality, "on target with minimal variation," one must eliminate assignable cause variation and reduce common cause variation. Capability indices compare the behavior of a process or product characteristic to customer specifications. Cpk provides an index of short-term actual capability, but can underestimate total variation. Ppk indexes long-term actual performance without this inherent flaw.

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PCB 007 George Milad: Reduction Assisted Immersion Gold for ENEPIG Surface Finish
Reduction Assisted Immersion Gold for ENEPIG Surface Finish

An article by George Milad, published in the June issue of PCB007 explores how using RAIG in place of standard immersion gold allows for the deposition of a thicker gold layer, and eliminates the risk of nickel corrosion under the palladium.

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Article on Nonlinear regression
Critical Success Factors for Implementing & Sustaining Quality Management Systems

This quantitative correlational study evaluates critical success factors for implementing and sustaining ISO 9001 and Lean Six Sigma in the North American printed circuit board industry. Canonical correlations were used for data analysis. A statistical correlation was found between critical success factors for implementing and sustaining ISO 9001 and Lean Six Sigma.

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I-Connect007 Interviews Rich DePoto at IPC APEX 2023 about RAIG
I-Connect007’s Pete Starkey interviewed Uyemura’s Rich DePoto at IPC APEX 2023.

Topics included the industry’s laudatory response to Uyemura’s unique RAIG (Reduction-Assisted Immersion Gold), and DIG (Direct Immersion Gold) processes. The advantages realized as Uyemura moved 80%+ of its manufacturing to the US were also discussed, also the emerging high frequency (100GHz+) marketplace and the key roles played by the EPIG and EPAG processes. DePoto’s leadership of an HDPug consortium addressing demands on final finishes posed by solderless connections, in particular the value of nickel-free products, were also covered.

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Semiconductor Packaging News - Viewpoint 2023
Semiconductor Packaging News – Viewpoint 2023

Tony Revier shared observations and predictions for 2023 in the February 23 “Viewpoint,” published by Semiconductor Packaging News. His comments covered the IC substrate marketplace, changing employee mindsets, and supply chain issues, among other topics.

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Tony Revier talks with Products Finishing Editor Scott Francis
Product Finishing interviews Uyemura's Tony Revier

Uyemura USA Founder and Finishing Hall of Fame Honoree Tony Revier talks with Products Finishing Editor Scott Francis in a wide-ranging March, 2022 interview

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PCB 007 George Milad: How the Pandemic Impacted PCB Manufacturing
The Pandemic’s Impact on PCB Manufacturing

Domestic PCB manufacturing and assembly needs a carefully coordinated effort between industry and government to regain the capacity required to prevent the supply shortages – and national security issues – caused by excess reliance on offshore suppliers.

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Article on Nonlinear regression
Practical Statistical Tools for Process Engineers

Statistics is a branch of mathematics that deals with collecting, analyzing, interpreting and presenting numerical data. But it’s not merely the science of analyzing data, but the art and science of collecting and analyzing data. A guide to the five practical statistical tools the process engineer should be familiar with.

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Article on Nonlinear regression
Application of Nonlinear Regression for Determining PCB Finish Thicknesses

Nonlinear regression is a powerful statistical tool, but it can be challenging to find the appropriate model and starting parameters. Understanding how to choose the proper model and starting parameters is critical. Linear and nonlinear regression methods are reviewed, and a worked example using electroless nickel immersion gold (ENIG) is provided.

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Article on Quality and continuous improvement
Quality and Continuous Improvement

Quality and continuous improvement are an integral part of the electronics industry. Poor quality is costly. Remediation costs of poor quality can cost a company 25% of its annual sales. Poor quality and the need for high reliability are the catalysts driving continuous improvement today. An in-depth review of quality and continuous improvement is presented.

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Article on Quality and continuous improvement
The Mechanism and Mitigation of Nickel Corrosion in ENEPIG Deposits

Paper explores the mechanism of nickel corrosion, the result of thin palladium, prolonged dwell in the immersion gold bath and the intrinsic corrosiveness of the immersion gold. Findings show immersion gold preferentially plates at the expense of the underlying nickel, if accessible, creating corrosion. Paper presents mitigation actions to prevent this defect.

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PCB 007 George Milad: An Overview of Surface Finishes
An Overview of Surface Finishes

George Milad’s latest column in PCB007’s Plating Forum traces the history of PCB surface finishes, and the factors that led to each new development. He further explores why “early” finishes, including HASL, I-Ag, I-Sn, and OSP, remain in widespread use, alongside advanced alternatives such as ENIG, ENEPIG, EPIG/EPAG, DIG, and ISIG.

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PCB 007 George Milad: The Significance of IPC ENIG Specification 4552 Rev B
The Significance of IPC ENIG Specification 4552 Rev B

IPC 4552B measures ENIG corrosion, producing a Product Rating and defining extent of corrosion. It also measures the phosphorous content of EN deposits and details how to calibrate and qualify XRF thickness measuring instruments. 

George Milad’s latest column in PCB007’s Plating Forum provides details.

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Reduction-Assisted Immersion Gold for ENIG, ENEPIG
Reduction-Assisted Immersion Gold for ENIG, ENEPIG

Flyer summarizes the benefits and advantages of RAIG – Reduction Assisted Immersion Gold as a high-performing gold alternative for ENIG and ENEPIG. Uyemura’s TWX-40 assures compliance with IPC 4552 as well as long term deposit layer reliability.

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EDACafe Interviews Rich DePoto
Video

Rich DePoto shared insights on final finishes for the PCB, additive and semiconductor industries in this interview with Sanjay Gangal of EDA Cafe. Key topics to the wide-ranging interview included the factors driving industry’s conversion from ENIG to ENEPIG, and the role of thicker gold deposits, particularly in hydrostatic and pogo pin assemblies. Uyemura has the world’s largest portfolio of thick gold electroless processes.

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I-Connect007 Interviews Rich DePoto at IPC APEX 2020
Video

I-Connect007 Interviews Rich DePoto who discusses the market acceptance of the RAIG heavy gold process, the demand for and the benefits of the ENEPIG process, and how the EPIG process satisfies applications where high-frequency SI and non-magnetic properties are mandatory and nickel must not be present.

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Article on Minimizing Signal Transmission Loss in High-Frequency Circuits
Via Plating for PWBs

Vias are an integral part of PWB design and manufacturing. They are the means by which different layers of a board are connected. There are three main types of vias: through-hole vias, buried vias, and blind vias.

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Article on Minimizing Signal Transmission Loss in High-Frequency Circuits
Minimizing Signal Transmission Loss in High-Frequency Circuits
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Article on EPIG: A Nickel-free Surface Finish for Next-generation Products
EPIG: A Nickel-free Surface Finish for Next-generation Products
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Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold
Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold
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Circuitnet - Viewpoint 2020
Circuitnet – Viewpoint 2020

Tony Revier, President of Uyemura USA, discusses the four significant trends that position Uyemura for success in this new decade.

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Semiconductor Packaging News - Viewpoint 2020
Semiconductor Packaging News – Viewpoint 2020

Uyemura Vice President, Don Gudeczauskas discusses how smaller form factors, shorter lead times, and harsh environment adaptability continue to push the industry into new territory.

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Uyemura In-line Solution
The EPIG Process

Flyer for Uyemura’s EPIG, nickel-free PCB finish, has opened up a wide, new design avenue for high frequency applications and designs with reduced spacing. The EPIG process deposits palladium directly onto copper, a perfect fit for applications that demand smaller features and better clearances.

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The IGEPIG Process
The IGEPIG Process

The 7 performance metrics of IGEPIG (Immersion Gold, Electroless Palladium, Immersion Gold).

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MEC Etchants
MEC from Uyemura

MEC Etchbond applications within PWB and IC substrates

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Uyemura In-line Solution
Uyemura In-line Solution

Flyer describes Uyemura chemistry that seamlessly converts an existing ENIG or ENEPIG line into one capable of processing all 3 major finishes: ENIG, ENEPIG and EPIG.

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Uyemura In-line Solution
General Metal Finishing

Miralloy Sn/ Pd/ Ni replacement in 4 formulations, including cyanide-free; electroless nickels, decorative finishes, technical finishes, gold electrolytes, high corrosion-resistant alloys

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Uyemura In-line Solution
Final Finishes

RAIG (Reduction-Assisted Immersion Gold) Talon 3, DIG (Direct Immersion Gold) EPIG/EPAG

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Uyemura In-line Solution
Acid Copper Plating

Through-hole plating: acid copper additive for high aspect ratios with fine line circuitry; void-free via fill, MEC copper etchants

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Uyemura In-line Solution
MEC PCB Solutions

MEC surface treatments to promote adhesion of dry film, soldermask and laminate, are described in a new brochure.

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EN Plating Control Technology
EN Plating Control Technology

Brochure describes STARLiNE DASH technology for automated sampling, analysis and replenishment of EN baths with exceptional accuracy.

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Rhoduna-Alloy 1 Galvanic Rhodium Alloy
Rhoduna-Alloy 1 Galvanic Rhodium Alloy

Formulated from rhodium and ruthenium; whiteness and performance is equal to the highest quality rhodium coatings, with greater smoothness and durability. Deposits directly on nickel, palladium, silver and gold; crack-free up to 1 μm.

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Platinized Titanium and MMO Anodes in Electroplating Applications
Platinized Titanium and MMO Anodes in Electroplating Applications

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Electrolytic Nickel-Phosphorus Plating
Electrolytic Nickel-Phosphorus Plating

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Uyemura provides market-leading metal finishing solutions and a sales and technical team unrivaled in its experience, knowledge and dedication.
Video

Uyemura provides market-leading metal finishing solutions and a sales and technical team unrivaled in its experience, knowledge and dedication.

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Meet the sales and technical team behind Uyemura's final finishes!
Video

Meet the sales and technical team behind Uyemura’s final finishes!

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Barrier Properties of an Electroless Deposit of Co-W-P Alloy
Barrier Properties of an Electroless Deposit of Co-W-P Alloy
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Characteristics of EPIG Deposits for Fine Line Applications
Characteristics of EPIG Deposits for Fine Line Applications
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Surface Finishes in a Lead Free World
Surface Finishes in a Lead Free World
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Direct Immersion Gold as a Final Finish
Direct Immersion Gold as a Final Finish
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Solder Joint Reliability of Gold Surface Finishes: ENIG, ENEPIG, DIG for PWB Assembled with Lead Free SAC Alloyd
Solder Joint Reliability of Gold Surface Finishes: ENIG, ENEPIG, DIG for PWB Assembled with Lead Free SAC Alloy
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Study of Ni-P / Pd / Au as a Final Finish for Silicon Wafers
Study of Ni-P / Pd / Au as a Final Finish for Silicon Wafers
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>Smooth Finish - Satin Nickel Plating Scores in Auto and Other Applications
Smooth Finish – Satin Nickel Plating Scores in Auto and Other Applications
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Characteristics of a Lead and Cadmium Free Electroless Nickel
Characteristics of a Lead and Cadmium Free Electroless Nickel
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Under Bump Metallization to Reduce Wafer Processing Costs
Under Bump Metallization to Reduce Wafer Processing Costs
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Electroless Plating for LTCC Metallization
Electroless Plating for LTCC Metallization
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ENeutral Autocatalytic Electroless Gold Plating Process
Neutral Autocatalytic Electroless Gold Plating Process
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Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead-free Soldering and Gold Wire Bonding
Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead-free Soldering and Gold Wire Bonding
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Study of the ENEPIG IMC for Eutectic and LF Solders
Study of the ENEPIG IMC for Eutectic and LF Solders
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Uyemura Surface Treatment Process Zeroes in on Tin
Uyemura Surface Treatment Process Zeroes in on Tin
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ENIG with Ductile Electroless Nickel for Flex Circuit Applications
ENIG with Ductile Electroless Nickel for Flex Circuit Applications
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Elimination of Whiskers from Electroplated Tin
Elimination of Whiskers from Electroplated Tin
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Electrolytic Nickel-Phosphorus Plating
Electrolytic Nickel-Phosphorus Plating
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Innovative Solutions for Leading Edge Designs
Innovative Solutions for Leading Edge Designs
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Surface Finishing for Lead-Free
Surface Finishing for Lead-Free
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Printed Circuit Boards: Final Finish Options
Printed Circuit Boards: Final Finish Options
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What's New in Vertical Acid Copper Plating for PCB Manufacturing
What's New in Vertical Acid Copper Plating for PCB Manufacturing
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New Developments in DC Acid Copper for Vertical Plating Tanks
New Developments in DC Acid Copper for Vertical Plating Tanks
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ENEPIG and Nickel Corrosion
ENEPIG and Nickel Corrosion
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Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
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