GOBRIGHT™ TNC-25 is a cyanide-free immersion gold bath for PWB applications. It was developed for use as the immersion gold layer for ENIG and ENEPIG surface finishes, and is an ideal, solderable finish for small SMT and BGA pads. The gold finish has excellent soldering characteristics. The bath is stable and easy to use.
Optimum results are achieved when Uyemura electroless nickel or electroless palladium are used as the underlying deposit for PWB and IC packaging.
GOBRIGHT TMX-23 is a neutral pH, cyanide-free, electroless gold for PWB applications. It was designed for IC packages (P-BGA, MCM and others) and for PWB wire bonding. For fine diameter gold wire, TMX-23 provides very stable wire bond pull strength.
The TMX-23 bath is highly stable, with a long service life. Deposition rates are consistent. TMX-23 requires Gobright TAW-66 TAM-55, TLA-77S or TWX-40 pre-deposit for initiation. Nimuden NPR-4 or NPR-8 electroless nickel is recommended for optimum results.
EPITHAS™ TDS-25 and TDS-25 MT are neutral pH, cyanide-free, immersion gold bath for silicon wafers. They were engineered specifically for electroless nickel/gold plating on aluminum or copper pads and are highly solderable. Bath control is straightforward, and bath stability is excellent. The Uyemura nickel plating bath is recommended as the under-layer for Epithas TDS-25 MT; for TDS-25, Uyemura’s nickel plating bath and palladium bath are recommended.
EPITHAS TMX-16 (MT) is a cyanide-free electroless gold bath for surface mount and wafer applications. The neutral pH of TMX-16 protects mask materials from attack. Deposition rate is 0.8 μm/hour. Epithas TDS-20 or TDS-25 immersion gold baths can be used as the under-layer; Epithas NPR or KSB Series electroless nickel are recommended for the TMX-16 plating process.
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GOBRIGHT TMX-21/23 is an alternative autocatalytic gold, a neutral electroless gold process that meets IC and PWB wire bonding requirements. These stable baths have an extended service life.
AuBEL Electroless Gold is a stable, alkaline pH, autocatalytic process which has been used in production for more than 20 years. It has a deposition rate of 80 micro inches per hour and produces a pure gold deposit: greater than 99.9%. AuBEL electroless gold has excellent gold wire bond properties. Both gold and reducer can be replenished.