Hard Silver Gold Replacement
ARGUNA® 630 GAM fine silver electrolyte for decorative use deposits thick, bright silver layers; relative to technical applications, it has excellent electrical, bonding and soldering characteristics and a hardness range of 120 HV to 130 HV. It is ideal for high mechanical stress applications, and significantly increases mating cycles and contact durability.
A reflection density of up to 1.5 GAM, and high temperature resistance, make it an excellent final finish for LEDs; it is also a high-quality conducting material for medical device and aerospace applications.
- Other features:
- Operating temperature up to 104°F (40°C)
- High voltage compatible
- Use in continuous lines using flow or spray technologies
- Suitable for all-over or selective silver plating of strip materials
- Transparent electrolyte
Bright Silver Electrolyte
ARGUNA 621 deposits brilliant white coatings. This electrolyte is suitable for decorative and technical applications, and is preferentially used on jewelry and parts with a similar profile. Very slight hazes may occur on large, smooth surface such as sheets or hollow ware. It has a wide range of current densities, and may be operated at higher temperatures.
ARGUNA 621 is carbonate-tolerant, and has excellent throwing power. For deposition on nickel, strike silver plating is unnecessary.
- Other features:
- Operating temperature up to 68° - 113°F (20° to 40°C)
- High voltage compatible
- Use in continuous lines using flow or spray technologies
- Suitable for all-over or selective silver plating of strip materials
- Transparent electrolyte
Semi-bright Silver Electrolyte
ARGUNA ET deposits smooth, fine-grained silver coatings up to 100 μm and greater. It can be used for full or selective deposition. Engineered for decorative and electrotechnical applications, it has excellent soldering and bonding properties and is ideal for leadframe packaging, semiconductors, and contact surfaces on electrical and electronic components. As-deposited hardness is 110-130 HV 0.025. Plating speed and current density depend on electrolyte agitation at the parts; high electrolyte flow allows very high current densities. ARGUNA ET is compatible with rack and barrel application.