Through-hole Plating

Thru-Cup EPL “high throwing power” acid copper additive is designed for high aspect ratios with fine line circuitry. It offers the simplicity of DC plating and competes favorably with complex waveforms of pulse plating.

The EPL Very High Aspect Ratio (25:1) plating process delivers greater than 60% throw, with zero dog-boning at the hole entrance. Its stable chemistry does not require continuous regeneration.

Through-hold plating for printed circuit board using Uyemura acid copper

The process produces a fine-grained equiaxed copper deposit. The leveling capability of Thru-Cup EPL overcomes irregularities on the substrate and prevents nodule growth. The deposit is bright and ductile with excellent elongation, tensile strength and metallurgical properties. Thru-Cup EPL plates as low as 5 ASF (0.5 ASD) and as high as 25 ASF (2.5ASD).

Thru-Cup EPL is a two-component system. The suppressor incorporates a carrier and a leveling component and controls deposit thickness uniformity; the brightener is the grain-refining additive. The solution components and additives have a wide operating window and are easily controlled by standard analytical methods.

Thru-Cup EPL is compatible with both air agitation and eductor agitation and both soluble and insoluble anodes. The insoluble anodes are titanium mesh coated with a mixed metal oxide (MMO).

Thru-Cup ETN is a high-speed copper process for use with insoluble anodes. It operates at up to 40 ASF current density and provides excellent performance for BVH immediately following make-up. Throwing power remains high despite bath aging. ECD-CF is easily controlled with CVS measurement.

Thru-Cup ECD-CF is a high-speed copper process for use with insoluble anodes. It operates at up to 40 ASF current density and provides excellent performance for BVH immediately following make-up. Throwing power remains high despite bath aging. ECD-CF is easily controlled with CVS measurement.

Thru-Cup ECD-H is a high throwing power acid copper additive for printed circuit board applications. It was designed for high-speed plating: as high as 50 ASF. It produces fine-grain equiaxed copper deposits that are bright and ductile with excellent elongation and tensile strength.

Thru-Cup AC-90 single-component acid copper additive system is a mixture of carrier and brightener with a wide operating window for general-purpose plating. The additives are mixed in the proper ratio for use as a single component system.

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