Electroless Palladium Processes

Talon 1 deposits an electroless / autocatalytic palladium as a surface finish for electronic and PCB applications. The palladium surface is solderable and aluminum/gold wire bondable.

The bath has a low palladium metal content and is highly stable. The rate of deposition and quality of the deposit are exceptionally consistent throughout the bath life.

Talon 2.2 process deposits palladium electrolessly on Nimuden® NPR-4 nickel plated printed circuit boards and electronic components. The palladium surface is solderable and wire bondable. Plating bath has a very low palladium metal content, reducing make-up and drag-out costs.

Talon 3 electroless palladium is a groundbreaking technology in board chemistry that allows plating directly onto copper. This development effectively paves the way for EPIG – electroless palladium/ immersion gold, a nickel-free alternative that becomes more consequential as lines become tighter and space more critical.

Talon 3 E-Pd was developed for applications that cannot tolerate nickel. These applications fall into four main categories: medical sensors, where nickel is prohibited for reasons of patient sensitivity; flexible circuits, where there’s a risk of nickel fracturing creating gaps in the circuits; electronic products with issues related to magnetics and frequency, and high frequency circuitry (particularly aerospace) where nickel can compromise signaling.

Talon 3 deposits an electroless / autocatalytic palladium that is solderable and gold wire bondable. The bath has a low palladium metal content and is highly stable. The rate of deposition and quality of the deposit are consistent throughout the product’s bath life.

The EPIG finish made possible with Talon 3 electroless palladium solders perfectly after eight hours of steam aging – a significant achievement.

Altarea TPD-21 is an autocatalytic electroless palladium bath for surface mount applications, including those with fine pattern characteristics. This pure palladium bath has excellent wire bonding characteristics for PCBs and IC packages, and excellent solderability using lead-free solder. As-plated hardness is 280Hv.

The bath is exceptionally stable and easy to control. For optimum performance, Nimuden® NPR series is the recommended electroless nickel under-layer.

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