Electroless Nickel / Autocatalytic Gold (ENAG)
ENAG is a high-performing final finish for wire bondable deposits, and an excellent alternative to immersion chemistry, or ENEPIG. It deposits 120-240 μins of nickel, 8-40 μins of electroless gold.
Read “Neutral Auto-Catalytic Electroless Gold Plating Process” in the Uyemura library.
Nimuden® NPR-8 nickel phosphorous plating solution was developed for fine line circuitry in electronic and PCB applications. Its higher phos content provides excellent corrosion performance, which can be further enhanced by increasing phos content. The phosphorous content in the deposited film remains constant regardless of metal turn-overs. NPR-8 has adhesive characteristics superior to electroplated nickel, is tolerant to dry film resist and soldermask, and is compatible with lead-free solders.
Gobright® TAW-66 immersion gold minimizes electroless nickel corrosion. This underlayer gold strike is light, requiring just 2 μm to produce a solder joint that is highly reliable over time, despite challenging conditions such as high temperature and humidity. TAW-66 immersion gold provides superior performance, with low porosity and low nickel dissolution. It is an ideal solderable finish for small SMT and BGA pads.
AuBEL Electroless Gold is an alkaline pH, autocatalytic process. It deposits at 80 μin per hour, and has excellent gold wire bond properties. Its alternative for ENAG processing is TMX-23.
Gobright® TMX-23 is a neutral autocatalytic/ electroless gold process that meets IC package (BGA, MCM, etc.) and PWB wire bonding requirements. TMX-23 is a stable bath with an extended service life, similar to its predecessor, TMX-21, but brighter, and with a better aesthetic.