PCB Processes: ENAG

Electroless Nickel / Autocatalytic Gold (ENAG)

ENAG is a high-performing final finish for wire bondable deposits, and an excellent alternative to immersion chemistry, or ENEPIG. Deposits 120-240 μins of nickel, 8-40 μins of electroless gold.

Read “Neutral Auto-Catalytic Electroless Gold Plating Process” in the Uyemura library.

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For more details, or to arrange test processing,
contact your Uyemura representative.