Immersion Tin Processes

Presa RMK-31 immersion tin bath produces a highly uniform surface finish (thickness control is 1.5 standard deviation from the mean) that is ideal for backplane and other press fit applications. The flat microstructure has excellent aesthetics, and minimal copper etch-back. Solderability is excellent, even with high temperature solders and when subjected to lengthy storage. The finish is compatible with eutectic and lead-free solders. Tin is deposited only on the copper surface via displacement; process cycles are up to 3X faster than the competitive average.

RMK-31 is a highly differentiated immersion tin that combines ionic cleanliness, excellent appearance, exceptional uniformity, and processing speed that can triple both line capacity and productivity. It is designed to meet the robust requirements in shelf life, solderability and thickness uniformity for "Category 3 Coating Durability" per IPC Tin Specification 4554.

Presa RMK-20 ver. AS-C immersion tin bath delivers excellent solderability and exhibits exceptional compatibility with solder mask. AS-C is used for final finish applications; it is compatible with the higher temperatures associated with lead-free solder assembly.

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Uyemura PCB finishes lead the world in plating performance.

EPIG (Electroless Palladium Immersion Gold) is a patented product and process of Uyemura.

For more details, or to arrange test processing,
contact your Uyemura representative.