Thru-Nic CL is the highest throw electrolytic nickel process available. Process typically yields a 5-fold increase in throwing power over standard nickel systems – nearly equal to electroless nickel plating. Nickel deposits in recessed locations without elaborate cathode arrangements. Pre-mixed, single component make-up and replenishment; low current density. Thru-Nic deposits are pure nickel, white, and sulfur and phosphorus-free, with low internal stress. They are ideal for lead frames, connectors, IC packages.
Niphos® 965 electrolyte produces the ideal intermediate layer prior to hard gold plating in reel-to-reel lines. PH stable process is superior to EN, producing layers that are amorphous, diamagnetic and abrasion and corrosion resistant. Niphos is contaminant-tolerant and free of halides, chloride, lead and cadmium.
Niphos 968 for barrel plating was developed to plate steel rods in hydraulics and shock absorbers: nickel-phosphorus layers are combined with chromium as a final layer. This combination allows lower thicknesses of the chromium and dramatically improves wear properties of the complete system.
KHW Antique-Nickel deposits a thin, bright layer of nickel the color of anthracite onto copper, brass, nickel, silver or tin. Bath is exceptionally stable; compatible with both rack and barrel application.
An intermediate layer of bright or satin nickel, and a post-plating lacquer layer are recommended for optimum results.
Electrolytic Nickel Gold
Thru-Nic AMT Nickel Plating Process has exceptionally high throwing power compared to sulfate baths. Deposits have a uniform matte white appearance and are sulfur and phosphorus-free. Thru-Nic AMT is an excellent gold plating undercoat; it is well suited to PCB applications, including small plated thru-holes, and preserves solder mask integrity.