CZ Roughening Treatment
Creating the best copper surface topography for the best product reliability.
MECetchBOND CZ Series Our organic-acid type copper micro-etching solution creates a unique roughened surface and achieves a higher physical adhesion to a variety of resins, including build-up resin, dry film etch resist and solder mask.
SILKYSURF AP Series This process improves the adhesion of copper and resin by combining an ultra-low etched, unique roughened surface and an organic film. It achieves the best adhesion to a variety of resins with a minimal loss of pattern dimensions.
Bonding by Anchor Effect MEC’s CZ series produces a unique super-fine surface roughness by preferential etching of copper surfaces. When resin systems are applied to this super-fine roughened surface, they will flow into this roughness and after solidifying, create a very strong bond due to the ‘anchor effect’.
Anisotropic etching improves etch factor and realizes finer patterns with copper chloride etching.
MECBRITE EXE Series Compatible with standard acid etching processes.
Features of EXE Series
- An additive agent for copper chloride etchant.
- Higher EF than a standard copper chloride etchant.
- Less pattern width variation after etching.
- No need to change your existing etching line.
- General controller can be used.
- Both hydrogen peroxide and sodium chlorate
can be used as oxidizers.
