Resource Type
Applications
Recent Advances in Final Finishes Push Past the Limits of Conventional Electrolytes
In a wide-ranging discussion, Uyemura Business Development Manager Rich DePoto explores DIG, RAIG, EPIG, and the competition fueled evolution from mSAP to full semi-additive SAP.
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ENEPIG Corrosion Mechanisms
Nickel corrosion and mitigation strategies are explored in this article, which covers process optimization through designed experiments, process management by statistical process control, and reduction-assisted immersion gold.
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Final Finishes and IC Substrates
PCB007 Managing Editor Marcy LaRont interviewed Business Development Manager Rich DePoto at IPC APEX. The discussion focused on the 5 priorities for OEMs evaluating process choices: high frequency, harsh environment resilience, fine pitches, cost, and the prominence of nickel-free systems including EPIG, IGEPIG, and EPAG.
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Process Yield Statistics and Distributions
Process yield statistics are powerful tools that help an organization see how defects impact their scrap, rework, warranty, and customer satisfaction. Understanding the fundamental basics is critical for process improvement. Process yield statistics and distributions are reviewed, and a worked example is provided.
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MEC from Uyemura -The Roadmap for High Density & Ultra High Density Circuits.
Uyemura’s Mission is creating and delivering practical solutions to the competitive, operational and environmental challenges our customers face. Together with MEC, we establish new benchmarks for performance, reliability and cost management.
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Measuring Quality Over Time
The Weibull distribution is a versatile and easily interpreted distribution for reliability analysis that can be used to model all three stages of a product's life cycle: infant mortality, design life, and wear-out stages. A model predicting the reliability of gold wire bonding on an electroless nickel electroless palladium immersion gold (ENEPIG) finish
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Next-generation RAIG Process
Paper evaluates a novel RAIG formulation using a non-hazardous stabilizer without compromising performance. Novel RAIG electrolyte eliminated gold plate-out, provided excellent deposit uniformity for ENIG and ENEPIG, had corrosion product ratings of zero per IPC-4552B.
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TWX-42 Flyer
GOBRIGHT™ TWX-42 RAIG (Reduction-assisted Immersion Gold) can produce significantly thicker gold deposits than standard immersion golds. It is an environmentally favored process for ENIG, ENEPIG, and EPIG, a 5th generation “mixed reaction” gold. Displacement initially occurs on the nickel surface; an autocatalytic reaction prevents nickel corrosion.
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IC Substrates Flyer
IC substrates datasheet overviews desmear products engineered for SAP, electroless coppers with ultra-low internal stress, advanced filler for through-holes and blind vias, auto-catalytic electroless palladium bath for fine-patterned surface mount applications, plus ENEPIG, EPIG, EPAG.
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Improved Finishing Options Power EV Battery Demand
Rich DePoto explores EV battery manufacturing challenges in an article published by Finishing & Coating. Among Uyemura lab’s high-priority projects: achieving good adhesion of platinum to titanium while building uniform thickness.
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Assessing Data Independence and Normality for Statistical Process Control Charts
Data independence and normality are underlying crucial assumptions for SPC charts. Understanding how to evaluate these two before charting data is critical. Methods for checking data independence and normality are reviewed and supported with examples.
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Statistical Process Control Charts: Sampling Frequency, Subgroups, and Plans
SPC charts are powerful tools, but determining the appropriate data collection parameters is challenging. Regular review of control chart limits enhances continuous improvement efforts.
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Cpk or Ppk? A Look at Using Both Capability Indices
In pursuing quality, "on target with minimal variation," one must eliminate assignable cause variation and reduce common cause variation. Capability indices compare the behavior of a process or product characteristic to customer specifications. Cpk provides an index of short-term actual capability, but can underestimate total variation. Ppk indexes long-term actual performance without this inherent flaw.
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Reduction Assisted Immersion Gold for ENEPIG Surface Finish
An article by George Milad, published in the June issue of PCB007 explores how using RAIG in place of standard immersion gold allows for the deposition of a thicker gold layer, and eliminates the risk of nickel corrosion under the palladium.
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Critical Success Factors for Implementing & Sustaining Quality Management Systems
This quantitative correlational study evaluates critical success factors for implementing and sustaining ISO 9001 and Lean Six Sigma in the North American printed circuit board industry. Canonical correlations were used for data analysis. A statistical correlation was found between critical success factors for implementing and sustaining ISO 9001 and Lean Six Sigma.
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I-Connect007’s Pete Starkey interviewed Uyemura’s Rich DePoto at IPC APEX 2023.
Topics included the industry’s laudatory response to Uyemura’s unique RAIG (Reduction-Assisted Immersion Gold), and DIG (Direct Immersion Gold) processes. The advantages realized as Uyemura moved 80%+ of its manufacturing to the US were also discussed, also the emerging high frequency (100GHz+) marketplace and the key roles played by the EPIG and EPAG processes. DePoto’s leadership of an HDPug consortium addressing demands on final finishes posed by solderless connections, in particular the value of nickel-free products, were also covered.
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Semiconductor Packaging News – Viewpoint 2023
Tony Revier shared observations and predictions for 2023 in the February 23 “Viewpoint,” published by Semiconductor Packaging News. His comments covered the IC substrate marketplace, changing employee mindsets, and supply chain issues, among other topics.
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Product Finishing interviews Uyemura's Tony Revier
Uyemura USA Founder and Finishing Hall of Fame Honoree Tony Revier talks with Products Finishing Editor Scott Francis in a wide-ranging March, 2022 interview
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The Pandemic’s Impact on PCB Manufacturing
Domestic PCB manufacturing and assembly needs a carefully coordinated effort between industry and government to regain the capacity required to prevent the supply shortages – and national security issues – caused by excess reliance on offshore suppliers.
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Practical Statistical Tools for Process Engineers
Statistics is a branch of mathematics that deals with collecting, analyzing, interpreting and presenting numerical data. But it’s not merely the science of analyzing data, but the art and science of collecting and analyzing data. A guide to the five practical statistical tools the process engineer should be familiar with.
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Application of Nonlinear Regression for Determining PCB Finish Thicknesses
Nonlinear regression is a powerful statistical tool, but it can be challenging to find the appropriate model and starting parameters. Understanding how to choose the proper model and starting parameters is critical. Linear and nonlinear regression methods are reviewed, and a worked example using electroless nickel immersion gold (ENIG) is provided.
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Quality and Continuous Improvement
Quality and continuous improvement are an integral part of the electronics industry. Poor quality is costly. Remediation costs of poor quality can cost a company 25% of its annual sales. Poor quality and the need for high reliability are the catalysts driving continuous improvement today. An in-depth review of quality and continuous improvement is presented.
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The Mechanism and Mitigation of Nickel Corrosion in ENEPIG Deposits
Paper explores the mechanism of nickel corrosion, the result of thin palladium, prolonged dwell in the immersion gold bath and the intrinsic corrosiveness of the immersion gold. Findings show immersion gold preferentially plates at the expense of the underlying nickel, if accessible, creating corrosion. Paper presents mitigation actions to prevent this defect.
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An Overview of Surface Finishes
George Milad’s latest column in PCB007’s Plating Forum traces the history of PCB surface finishes, and the factors that led to each new development. He further explores why “early” finishes, including HASL, I-Ag, I-Sn, and OSP, remain in widespread use, alongside advanced alternatives such as ENIG, ENEPIG, EPIG/EPAG, DIG, and ISIG.
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The Significance of IPC ENIG Specification 4552 Rev B
IPC 4552B measures ENIG corrosion, producing a Product Rating and defining extent of corrosion. It also measures the phosphorous content of EN deposits and details how to calibrate and qualify XRF thickness measuring instruments.
George Milad’s latest column in PCB007’s Plating Forum provides details.
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ClearSignals Newsletter
ENEPIG: now in the US northeast! R&D Altanova, leading provider of turnkey test interface solutions to the largest integrated device mfgs, fabless semicons and semicon foundries, supports 5G, AI, radar, autonomous vehicles and IoT with Uyemura’s reduction-assisted gold process. Uniform, corrosion-free deposits, tight pitch/spacing capability and excellent thru-hole plating are key advantages.
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Reduction-Assisted Immersion Gold for ENIG, ENEPIG
Flyer summarizes the benefits and advantages of RAIG – Reduction Assisted Immersion Gold as a high-performing gold alternative for ENIG and ENEPIG. Uyemura’s TWX-40 assures compliance with IPC 4552 as well as long term deposit layer reliability.
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ClearSignals Newsletter
APEX edition of “Clear Signals” outlines the benefits of RAIG – Reduction Assisted Immersion Gold – as demand for thicker gold deposits without corrosion increases. Issue also profiles Data Electronic Services (DES) and its experience with ENIG and ENEPIG, and a unique board chemistry for plating electroless palladium plating directly on copper.
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Video
Rich DePoto shared insights on final finishes for the PCB, additive and semiconductor industries in this interview with Sanjay Gangal of EDA Cafe. Key topics to the wide-ranging interview included the factors driving industry’s conversion from ENIG to ENEPIG, and the role of thicker gold deposits, particularly in hydrostatic and pogo pin assemblies. Uyemura has the world’s largest portfolio of thick gold electroless processes.
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Video
I-Connect007 Interviews Rich DePoto who discusses the market acceptance of the RAIG heavy gold process, the demand for and the benefits of the ENEPIG process, and how the EPIG process satisfies applications where high-frequency SI and non-magnetic properties are mandatory and nickel must not be present.
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Via Plating for PWBs
Vias are an integral part of PWB design and manufacturing. They are the means by which different layers of a board are connected. There are three main types of vias: through-hole vias, buried vias, and blind vias.
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Minimizing Signal Transmission Loss in High-Frequency Circuits
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EPIG: A Nickel-free Surface Finish for Next-generation Products
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Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold
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Circuitnet – Viewpoint 2020
Tony Revier, President of Uyemura USA, discusses the four significant trends that position Uyemura for success in this new decade.
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Semiconductor Packaging News – Viewpoint 2020
Uyemura Vice President, Don Gudeczauskas discusses how smaller form factors, shorter lead times, and harsh environment adaptability continue to push the industry into new territory.
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The EPIG Process
Flyer for Uyemura’s EPIG, nickel-free PCB finish, has opened up a wide, new design avenue for high frequency applications and designs with reduced spacing. The EPIG process deposits palladium directly onto copper, a perfect fit for applications that demand smaller features and better clearances.
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ClearSignals Newsletter
Pre-APEX edition of “Clear Signals” explores one of the most contested – and contentious – issues in board manufacturing: customer demand for heavier gold as the final ENIG / ENEPIG step.
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Surface Performance Newsletter
Newsletter for general metal finishing profiles New England powerhouse, Unimetal, its experience with advanced trimetal technology and organic nanotech sealants, and its moves toward closed loop operation.
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The IGEPIG Process
The 7 performance metrics of IGEPIG (Immersion Gold, Electroless Palladium, Immersion Gold).
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Uyemura In-line Solution
Flyer describes Uyemura chemistry that seamlessly converts an existing ENIG or ENEPIG line into one capable of processing all 3 major finishes: ENIG, ENEPIG and EPIG.
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General Metal Finishing
Miralloy Sn/ Pd/ Ni replacement in 4 formulations, including cyanide-free; electroless nickels, decorative finishes, technical finishes, gold electrolytes, high corrosion-resistant alloys
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Final Finishes
RAIG (Reduction-Assisted Immersion Gold) Talon 3, DIG (Direct Immersion Gold) EPIG/EPAG
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Acid Copper Plating
Through-hole plating: acid copper additive for high aspect ratios with fine line circuitry; void-free via fill, MEC copper etchants
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MEC PCB Solutions
MEC surface treatments to promote adhesion of dry film, soldermask and laminate, are described in a new brochure.
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EN Plating Control Technology
Brochure describes STARLiNE DASH™ technology for automated sampling, analysis and replenishment of EN baths with exceptional accuracy.
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Rhoduna-Alloy 1 Galvanic Rhodium Alloy
Formulated from rhodium and ruthenium; whiteness and performance is equal to the highest quality rhodium coatings, with greater smoothness and durability. Deposits directly on nickel, palladium, silver and gold; crack-free up to 1 μm.
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Platinized Titanium and MMO Anodes in Electroplating Applications
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Electrolytic Nickel-Phosphorus Plating
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Video
Uyemura provides market-leading metal finishing solutions and a sales and technical team unrivaled in its experience, knowledge and dedication.
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Barrier Properties of an Electroless Deposit of Co-W-P Alloy
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Characteristics of EPIG Deposits for Fine Line Applications
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Surface Finishes in a Lead Free World
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Direct Immersion Gold as a Final Finish
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Solder Joint Reliability of Gold Surface Finishes: ENIG, ENEPIG, DIG for PWB Assembled with Lead Free SAC Alloy
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Study of Ni-P / Pd / Au as a Final Finish for Silicon Wafers
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Smooth Finish – Satin Nickel Plating Scores in Auto and Other Applications
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Characteristics of a Lead and Cadmium Free Electroless Nickel
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Under Bump Metallization to Reduce Wafer Processing Costs
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Electroless Plating for LTCC Metallization
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Neutral Autocatalytic Electroless Gold Plating Process
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Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead-free Soldering and Gold Wire Bonding
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Study of the ENEPIG IMC for Eutectic and LF Solders
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Uyemura Surface Treatment Process Zeroes in on Tin
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ENIG with Ductile Electroless Nickel for Flex Circuit Applications
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Elimination of Whiskers from Electroplated Tin
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Electrolytic Nickel-Phosphorus Plating
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Innovative Solutions for Leading Edge Designs
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Surface Finishing for Lead-Free
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Printed Circuit Boards: Final Finish Options
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What's New in Vertical Acid Copper Plating for PCB Manufacturing
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New Developments in DC Acid Copper for Vertical Plating Tanks
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ENEPIG and Nickel Corrosion
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