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Applications
![I-Connect007 Interviews Rich DePoto at IPC APEX 2023 about RAIG](img/video-apex-2024.jpg)
Final Finishes and IC Substrates
PCB007 Managing Editor Marcy LaRont interviewed Business Development Manager Rich DePoto at IPC APEX. The discussion focused on the 5 priorities for OEMs evaluating process choices: high frequency, harsh environment resilience, fine pitches, cost, and the prominence of nickel-free systems including EPIG, IGEPIG, and EPAG.
Play Video![MEC from Uyemura - The Roadmap for High Density & Ultra High Density Circuits.](img/MEC-from-Uyemura.png)
MEC from Uyemura -The Roadmap for High Density & Ultra High Density Circuits.
Uyemura’s Mission is creating and delivering practical solutions to the competitive, operational and environmental challenges our customers face. Together with MEC, we establish new benchmarks for performance, reliability and cost management.
Read Brochure![Article on Using the Weibull Distribution to Model Reliability Data](img/pat-valentine-article.jpg)
Measuring Quality Over Time
The Weibull distribution is a versatile and easily interpreted distribution for reliability analysis that can be used to model all three stages of a product's life cycle: infant mortality, design life, and wear-out stages. A model predicting the reliability of gold wire bonding on an electroless nickel electroless palladium immersion gold (ENEPIG) finish
Read Article![Article on Quality and continuous improvement](img/article-icon.jpg)
Next-generation RAIG Process
Paper evaluates a novel RAIG formulation using a non-hazardous stabilizer without compromising performance. Novel RAIG electrolyte eliminated gold plate-out, provided excellent deposit uniformity for ENIG and ENEPIG, had corrosion product ratings of zero per IPC-4552B.
Read Article![Gobright TWX-42 Reduction-Assisted Immersion Gold](img/twx-42-flyer.png)
TWX-42 Flyer
GOBRIGHT™ TWX-42 RAIG (Reduction-assisted Immersion Gold) can produce significantly thicker gold deposits than standard immersion golds. It is an environmentally favored process for ENIG, ENEPIG, and EPIG, a 5th generation “mixed reaction” gold. Displacement initially occurs on the nickel surface; an autocatalytic reaction prevents nickel corrosion.
View Flyer![IC Substrates EPITHAS™ Platform](img/IC-Substrates-Flyer.png)
IC Substrates Flyer
IC substrates datasheet overviews desmear products engineered for SAP, electroless coppers with ultra-low internal stress, advanced filler for through-holes and blind vias, auto-catalytic electroless palladium bath for fine-patterned surface mount applications, plus ENEPIG, EPIG, EPAG.
View Flyer![From Finsihing and Coatings: Rich Depoto on Improved Finishing Options Powering EV Battery Demand](img/rich-article.png)
Improved Finishing Options Power EV Battery Demand
Rich DePoto explores EV battery manufacturing challenges in an article published by Finishing & Coating. Among Uyemura lab’s high-priority projects: achieving good adhesion of platinum to titanium while building uniform thickness.
Read Article![Article on Assessing Data Independence and Normality for SPC Charts](img/pat-valentine-article.jpg)
Assessing Data Independence and Normality for Statistical Process Control Charts
Data independence and normality are underlying crucial assumptions for SPC charts. Understanding how to evaluate these two before charting data is critical. Methods for checking data independence and normality are reviewed and supported with examples.
Read Article![Article on Statistical Process Control Charts](img/pat-valentine-article.jpg)
Statistical Process Control Charts: Sampling Frequency, Subgroups, and Plans
SPC charts are powerful tools, but determining the appropriate data collection parameters is challenging. Regular review of control chart limits enhances continuous improvement efforts.
Read Article![Article on Cpk or Ppk](img/pat-valentine-article.jpg)
Cpk or Ppk? A Look at Using Both Capability Indices
In pursuing quality, "on target with minimal variation," one must eliminate assignable cause variation and reduce common cause variation. Capability indices compare the behavior of a process or product characteristic to customer specifications. Cpk provides an index of short-term actual capability, but can underestimate total variation. Ppk indexes long-term actual performance without this inherent flaw.
Read Article![PCB 007 George Milad: Reduction Assisted Immersion Gold for ENEPIG Surface Finish](img/article-george.png)
Reduction Assisted Immersion Gold for ENEPIG Surface Finish
An article by George Milad, published in the June issue of PCB007 explores how using RAIG in place of standard immersion gold allows for the deposition of a thicker gold layer, and eliminates the risk of nickel corrosion under the palladium.
Read Article![Article on Nonlinear regression](img/pat-valentine-article.jpg)
Critical Success Factors for Implementing & Sustaining Quality Management Systems
This quantitative correlational study evaluates critical success factors for implementing and sustaining ISO 9001 and Lean Six Sigma in the North American printed circuit board industry. Canonical correlations were used for data analysis. A statistical correlation was found between critical success factors for implementing and sustaining ISO 9001 and Lean Six Sigma.
Read Article![I-Connect007 Interviews Rich DePoto at IPC APEX 2023 about RAIG](img/video-apex-2023.jpg)
I-Connect007’s Pete Starkey interviewed Uyemura’s Rich DePoto at IPC APEX 2023.
Topics included the industry’s laudatory response to Uyemura’s unique RAIG (Reduction-Assisted Immersion Gold), and DIG (Direct Immersion Gold) processes. The advantages realized as Uyemura moved 80%+ of its manufacturing to the US were also discussed, also the emerging high frequency (100GHz+) marketplace and the key roles played by the EPIG and EPAG processes. DePoto’s leadership of an HDPug consortium addressing demands on final finishes posed by solderless connections, in particular the value of nickel-free products, were also covered.
Play Video![Semiconductor Packaging News - Viewpoint 2023](img/tony-viewpoint.png)
Semiconductor Packaging News – Viewpoint 2023
Tony Revier shared observations and predictions for 2023 in the February 23 “Viewpoint,” published by Semiconductor Packaging News. His comments covered the IC substrate marketplace, changing employee mindsets, and supply chain issues, among other topics.
Read Article![Tony Revier talks with Products Finishing Editor Scott Francis](img/tony-interview.png)
Product Finishing interviews Uyemura's Tony Revier
Uyemura USA Founder and Finishing Hall of Fame Honoree Tony Revier talks with Products Finishing Editor Scott Francis in a wide-ranging March, 2022 interview
Play Audio![PCB 007 George Milad: How the Pandemic Impacted PCB Manufacturing](img/george-article.jpg)
The Pandemic’s Impact on PCB Manufacturing
Domestic PCB manufacturing and assembly needs a carefully coordinated effort between industry and government to regain the capacity required to prevent the supply shortages – and national security issues – caused by excess reliance on offshore suppliers.
Read Article![Article on Nonlinear regression](img/pat-valentine-article.jpg)
Practical Statistical Tools for Process Engineers
Statistics is a branch of mathematics that deals with collecting, analyzing, interpreting and presenting numerical data. But it’s not merely the science of analyzing data, but the art and science of collecting and analyzing data. A guide to the five practical statistical tools the process engineer should be familiar with.
Read Article![Article on Nonlinear regression](img/pat-valentine-article.jpg)
Application of Nonlinear Regression for Determining PCB Finish Thicknesses
Nonlinear regression is a powerful statistical tool, but it can be challenging to find the appropriate model and starting parameters. Understanding how to choose the proper model and starting parameters is critical. Linear and nonlinear regression methods are reviewed, and a worked example using electroless nickel immersion gold (ENIG) is provided.
Read Article![Article on Quality and continuous improvement](img/article-icon.jpg)
Quality and Continuous Improvement
Quality and continuous improvement are an integral part of the electronics industry. Poor quality is costly. Remediation costs of poor quality can cost a company 25% of its annual sales. Poor quality and the need for high reliability are the catalysts driving continuous improvement today. An in-depth review of quality and continuous improvement is presented.
Read Article![Article on Quality and continuous improvement](img/article-icon.jpg)
The Mechanism and Mitigation of Nickel Corrosion in ENEPIG Deposits
Paper explores the mechanism of nickel corrosion, the result of thin palladium, prolonged dwell in the immersion gold bath and the intrinsic corrosiveness of the immersion gold. Findings show immersion gold preferentially plates at the expense of the underlying nickel, if accessible, creating corrosion. Paper presents mitigation actions to prevent this defect.
Read Article![PCB 007 George Milad: An Overview of Surface Finishes](img/article-george.png)
An Overview of Surface Finishes
George Milad’s latest column in PCB007’s Plating Forum traces the history of PCB surface finishes, and the factors that led to each new development. He further explores why “early” finishes, including HASL, I-Ag, I-Sn, and OSP, remain in widespread use, alongside advanced alternatives such as ENIG, ENEPIG, EPIG/EPAG, DIG, and ISIG.
Read Article![PCB 007 George Milad: The Significance of IPC ENIG Specification 4552 Rev B](img/article-george.png)
The Significance of IPC ENIG Specification 4552 Rev B
IPC 4552B measures ENIG corrosion, producing a Product Rating and defining extent of corrosion. It also measures the phosphorous content of EN deposits and details how to calibrate and qualify XRF thickness measuring instruments.
George Milad’s latest column in PCB007’s Plating Forum provides details.
Read Article![Reduction-Assisted Immersion Gold for ENIG, ENEPIG](img/article-RAIG.jpg)
Reduction-Assisted Immersion Gold for ENIG, ENEPIG
Flyer summarizes the benefits and advantages of RAIG – Reduction Assisted Immersion Gold as a high-performing gold alternative for ENIG and ENEPIG. Uyemura’s TWX-40 assures compliance with IPC 4552 as well as long term deposit layer reliability.
View Flyer![EDACafe Interviews Rich DePoto](img/th-video-EDACafe.jpg)
Video
Rich DePoto shared insights on final finishes for the PCB, additive and semiconductor industries in this interview with Sanjay Gangal of EDA Cafe. Key topics to the wide-ranging interview included the factors driving industry’s conversion from ENIG to ENEPIG, and the role of thicker gold deposits, particularly in hydrostatic and pogo pin assemblies. Uyemura has the world’s largest portfolio of thick gold electroless processes.
Play Video![I-Connect007 Interviews Rich DePoto at IPC APEX 2020](img/video-apex-2020.jpg)
Video
I-Connect007 Interviews Rich DePoto who discusses the market acceptance of the RAIG heavy gold process, the demand for and the benefits of the ENEPIG process, and how the EPIG process satisfies applications where high-frequency SI and non-magnetic properties are mandatory and nickel must not be present.
Play Video![Article on Minimizing Signal Transmission Loss in High-Frequency Circuits](img/article-icon.jpg)
Via Plating for PWBs
Vias are an integral part of PWB design and manufacturing. They are the means by which different layers of a board are connected. There are three main types of vias: through-hole vias, buried vias, and blind vias.
Read Article![Article on Minimizing Signal Transmission Loss in High-Frequency Circuits](img/article-icon.jpg)
Minimizing Signal Transmission Loss in High-Frequency Circuits
Read Article![Article on EPIG: A Nickel-free Surface Finish for Next-generation Products](img/article-icon.jpg)
EPIG: A Nickel-free Surface Finish for Next-generation Products
Read Article![Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold](img/article-icon.jpg)
Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold
Read Article![Circuitnet - Viewpoint 2020](img/article-circuitnet-tony.jpg)
Circuitnet – Viewpoint 2020
Tony Revier, President of Uyemura USA, discusses the four significant trends that position Uyemura for success in this new decade.
Read Article![Semiconductor Packaging News - Viewpoint 2020](img/article-spn-don.jpg)
Semiconductor Packaging News – Viewpoint 2020
Uyemura Vice President, Don Gudeczauskas discusses how smaller form factors, shorter lead times, and harsh environment adaptability continue to push the industry into new territory.
Read Article![Uyemura In-line Solution](img/article-EPIG.jpg)
The EPIG Process
Flyer for Uyemura’s EPIG, nickel-free PCB finish, has opened up a wide, new design avenue for high frequency applications and designs with reduced spacing. The EPIG process deposits palladium directly onto copper, a perfect fit for applications that demand smaller features and better clearances.
View Flyer![The IGEPIG Process](img/The-IGEPIG-Process.jpg)
The IGEPIG Process
The 7 performance metrics of IGEPIG (Immersion Gold, Electroless Palladium, Immersion Gold).
View Flyer![MEC Etchants](img/MEC-Flyer.png)
![Uyemura In-line Solution](img/Uyemura-in-line-Solution.jpg)
Uyemura In-line Solution
Flyer describes Uyemura chemistry that seamlessly converts an existing ENIG or ENEPIG line into one capable of processing all 3 major finishes: ENIG, ENEPIG and EPIG.
View Flyer![Uyemura In-line Solution](img/Media_GMF_Linecard.jpg)
General Metal Finishing
Miralloy Sn/ Pd/ Ni replacement in 4 formulations, including cyanide-free; electroless nickels, decorative finishes, technical finishes, gold electrolytes, high corrosion-resistant alloys
View PDF![Uyemura In-line Solution](img/thumb-line-card.jpg)
Final Finishes
RAIG (Reduction-Assisted Immersion Gold) Talon 3, DIG (Direct Immersion Gold) EPIG/EPAG
View PDF![Uyemura In-line Solution](img/thumb-line-card-acid-copper-plating.jpg)
Acid Copper Plating
Through-hole plating: acid copper additive for high aspect ratios with fine line circuitry; void-free via fill, MEC copper etchants
View PDF![Uyemura In-line Solution](img/Media_MEC.jpg)
MEC PCB Solutions
MEC surface treatments to promote adhesion of dry film, soldermask and laminate, are described in a new brochure.
View PDF![EN Plating Control Technology](img/Starline_2018-Brochure.jpg)
EN Plating Control Technology
Brochure describes STARLiNE DASH™ technology for automated sampling, analysis and replenishment of EN baths with exceptional accuracy.
View PDF![Rhoduna-Alloy 1 Galvanic Rhodium Alloy](img/Uyemura-Rhoduna-Flyer.png)
Rhoduna-Alloy 1 Galvanic Rhodium Alloy
Formulated from rhodium and ruthenium; whiteness and performance is equal to the highest quality rhodium coatings, with greater smoothness and durability. Deposits directly on nickel, palladium, silver and gold; crack-free up to 1 μm.
View PDF![Platinized Titanium and MMO Anodes in Electroplating Applications](img/Plat-Titanium.jpg)
Platinized Titanium and MMO Anodes in Electroplating Applications
View PDF![Electrolytic Nickel-Phosphorus Plating](img/Nic-phos.jpg)
Electrolytic Nickel-Phosphorus Plating
View PDF![Uyemura provides market-leading metal finishing solutions and a sales and technical team unrivaled in its experience, knowledge and dedication.](img/video-experts.jpg)
Video
Uyemura provides market-leading metal finishing solutions and a sales and technical team unrivaled in its experience, knowledge and dedication.
Play Video![Meet the sales and technical team behind Uyemura's final finishes!](img/video-number-1.jpg)
![Barrier Properties of an Electroless Deposit of Co-W-P Alloy](img/article-icon.jpg)
Barrier Properties of an Electroless Deposit of Co-W-P Alloy
Read Article![Characteristics of EPIG Deposits for Fine Line Applications](img/article-icon.jpg)
Characteristics of EPIG Deposits for Fine Line Applications
Read Article![Surface Finishes in a Lead Free World](img/article-icon.jpg)
Surface Finishes in a Lead Free World
Read Article![Direct Immersion Gold as a Final Finish](img/article-icon.jpg)
Direct Immersion Gold as a Final Finish
Read Article![Solder Joint Reliability of Gold Surface Finishes: ENIG, ENEPIG, DIG for PWB Assembled with Lead Free SAC Alloyd](img/article-icon.jpg)
Solder Joint Reliability of Gold Surface Finishes: ENIG, ENEPIG, DIG for PWB Assembled with Lead Free SAC Alloy
Read Article![Study of Ni-P / Pd / Au as a Final Finish for Silicon Wafers](img/article-icon.jpg)
Study of Ni-P / Pd / Au as a Final Finish for Silicon Wafers
Read Article![>Smooth Finish - Satin Nickel Plating Scores in Auto and Other Applications](img/article-icon.jpg)
Smooth Finish – Satin Nickel Plating Scores in Auto and Other Applications
Read Article![Characteristics of a Lead and Cadmium Free Electroless Nickel](img/article-icon.jpg)
Characteristics of a Lead and Cadmium Free Electroless Nickel
Read Article![Under Bump Metallization to Reduce Wafer Processing Costs](img/article-icon.jpg)
Under Bump Metallization to Reduce Wafer Processing Costs
Read Article![Electroless Plating for LTCC Metallization](img/article-icon.jpg)
Electroless Plating for LTCC Metallization
Read Article![ENeutral Autocatalytic Electroless Gold Plating Process](img/article-icon.jpg)
Neutral Autocatalytic Electroless Gold Plating Process
Read Article![Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead-free Soldering and Gold Wire Bonding](img/article-icon.jpg)
Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead-free Soldering and Gold Wire Bonding
Read Article![Study of the ENEPIG IMC for Eutectic and LF Solders](img/article-icon.jpg)
Study of the ENEPIG IMC for Eutectic and LF Solders
Read Article![Uyemura Surface Treatment Process Zeroes in on Tin](img/article-icon.jpg)
Uyemura Surface Treatment Process Zeroes in on Tin
Read Article![ENIG with Ductile Electroless Nickel for Flex Circuit Applications](img/article-icon.jpg)
ENIG with Ductile Electroless Nickel for Flex Circuit Applications
Read Article![Elimination of Whiskers from Electroplated Tin](img/article-icon.jpg)
Elimination of Whiskers from Electroplated Tin
Read Article![Electrolytic Nickel-Phosphorus Plating](img/article-icon.jpg)
Electrolytic Nickel-Phosphorus Plating
Read Article![Innovative Solutions for Leading Edge Designs](img/article-icon.jpg)
Innovative Solutions for Leading Edge Designs
Read Article![Surface Finishing for Lead-Free](img/article-icon.jpg)
Surface Finishing for Lead-Free
Read Article![Printed Circuit Boards: Final Finish Options](img/article-icon.jpg)
Printed Circuit Boards: Final Finish Options
Read Article![What's New in Vertical Acid Copper Plating for PCB Manufacturing](img/article-icon.jpg)
What's New in Vertical Acid Copper Plating for PCB Manufacturing
Read Article![New Developments in DC Acid Copper for Vertical Plating Tanks](img/article-icon.jpg)
New Developments in DC Acid Copper for Vertical Plating Tanks
Read Article![ENEPIG and Nickel Corrosion](img/article-icon.jpg)
ENEPIG and Nickel Corrosion
Read Article![Comparing Soldering Results of ENIG and EPIG Post Steam Exposure](img/article-icon.jpg)