High-speed Gold Electrolytes
Auruna® 559 Fine Gold Electrolyte is used for the very fast deposition of semi-bright to satin gold coatings. with excellent bonding and soldering properties. This neutral electrolyte was specifically developed for use in high-speed equipment for selective gold plating. The layers provide outstanding bondability and excellent temperature resistance. They are ductile and smooth, and light-yellow even at layer thickness greater than 20 μm.
Auruna 7100 operates at high current densities and deposition rates, is ideally suited to reel-to-reel systems. Coatings are brilliant, hard, solderable, and abrasion resistant, with consistently low contact resistance.
Auruna 8100 offers highest plating speeds, and an extended operating range. Hard gold coatings are low-porosity and wear resistant.
| Auruna® 7100 | Auruna® 8100 | |
| Current density range (Jet-Lab, 12 g/l Au, pH 4.4) |
up to 40 A/dm2 | up to 80 A/dm2 |
| Hardness | 140-200 HV10 | 120-200 HV10 |
| Plating speed | up to 9 μm/min | up to 11 μm/min |
Auruna 7100 and 8100 are ideal for electronic components such as contacts, connectors, and edge connectors on PCBs.
High speed Nickel-Phosphorus Electrolyte
Niphos® 6500 is an advanced solution to problematic “bottlenecks” on R2R lines, plating twice as fast as conventional electrolytic nickel processes while maintaining the same level of phosphorus in the plated layer. Niphos 6500 has a phosphorus content of 6 -11 %, with very low internal stress and low susceptibility to cracking. It provides excellent corrosion protection and has a broad range of uses:
- It is an exceptional intermediate layer for hard gold plating, reducing gold thickness and producing significant cost savings.
- It has shown strong performance in high frequency connectors and sensor applications.
- Used on high-stress automotive and industrial components, it increases durability, reduces friction, retards wear, and helps manage heat transfer. It also enhances surface hardness: Niphos 6500 has an HV of 550-600.
Niphos® 965 electrolyte produces the ideal intermediate layer prior to hard gold plating in reel-to-reel lines. PH stable process is superior to EN, producing layers that are amorphous, diamagnetic and abrasion and corrosion resistant. Niphos is contaminant-tolerant and free of halides, chloride, lead and cadmium.
High-speed Palladium-Nickel Electrolyte
Palluna® 4700 is a chloride-free, high-speed electrolyte for the deposition of semi-bright to bright palladium-nickel alloy in reel-to-reel lines. Depending on operating conditions, the electrolyte deposits alloy layers with approx. 80% of Pd; alloy composition is largely independent of current density. The hard, wear and corrosion-resistant layers are ductile, with low internal stresses. Applications include industrial connectors such as those used in data and signal transmission.
Palluna ACF-100 palladium nickel electrolyte also produces ductile, crack-free deposits that resist abrasion. With contact properties comparable to hard gold, it is a cost-effective option; the electrolyte deposits alloy coatings of approximately 80% Pd; hardness is 500-550 HV. ACF-100 is ideal for electrical contacts.
Pure Palladium Electrolytes for Ultra Bright White Coatings
Palluna 457 produces crack-free, bendable coatings up to 3 μm with a hardness of 300-350 HV 0.015. Plating speed is 0.24 μm/minute at 1 A/dm2; 0.12 μm at 0.5 A/dm2.
Palluna ACF-800 neutral pure palladium electrolyte plates directly on nickel or copper within a wide operating window. Most notably, it solves the issue of palladium cracking.
ACF-800 is a certified crack-free ammonia and chloride-free palladium electrolyte. Without ammonia, off-gassing is not an issue, stability is high and odor is non-existent. Ductile, ultra-bright deposits have a hardness of 280 V. It is ideal for PCBs, contacts on plug-in cards, and smartcards.
Precious Metal Alternative
Miralloy® 2841 HS replaces silver, palladium and nickel for many applications, and was engineered specifically for R2R processing. This versatile alloy is 51% copper, 33% tin and 17% zinc; it deposits up to 2 μm at .9 μm/minute.
Miralloy has a mirror-like finish that maintains the brilliance of base materials. It it abrasion resistant and has a hardness value equal to electroplated nickel. Miralloy 2841 offers excellent solderability.
This versatile finish is also tarnish-free, RoHS compliant, and diamagnetic.
Sealing 691 is Uyemura’s new generation of nanotechnology-based anti-tarnish processes. Developed by Umicore and available throughout North America exclusively from Uyemura, it provides high levels of protection from tarnish and corrosion, and robust technical properties.
Sealing 691’s proprietary organic molecule has a unique affinity for electrodeposition – and unrivaled process flexibility. It has a short dwell time – as little as 4 seconds, compared to competitive products at approximately 30 seconds – and is ideally suited to reel-to-reel processing.
Layers applied with an electrical potential can be deposited at high density (low porosity), resulting in exceptional corrosion performance. Sealing 691 maintains contact resistance well below 10 MΩ . It is compatible with soldering.