Electroless Copper Processes

Desmear Products

THRU-CUP™ DEC-6000 permanganate desmear pretreatment increases electroless and electrolytic copper adhesion. DEC-6000 softens and swells the laminate, enhancing the desmear process.

THRU-CUP™DEC-7000 etches the smear from the PCB holes after the sweller pretreatment. The desmear forms a cellular, rough surface, improving palladium absorption and enhancing electroless copper adhesion to the epoxy laminate.

THRU-CUP™ DEC-8000 acidic reducing neutralizer / conditioner solution reduces and dissolves manganese residues following permanganate treatment. The bath neutralizes alkalinity and prevents oxidizer drag into the process.

THRU-CUP™ DEC-9000 glass etch removes and frosts glass filaments, penetrating the PCB hole post desmear.

Powered by science
Focused on customers

Uyemura PCB finishes lead the world in plating performance.

EPIG (Electroless Palladium Immersion Gold) is a patented product and process of Uyemura.

For more details, or to arrange test processing,
contact your Uyemura representative.

CONTACT