Electroless Copper Processes

Desmear Products

THRU-CUP™ DEC-6000 permanganate desmear pretreatment increases electroless and electrolytic copper adhesion. DEC-6000 softens and swells the laminate, enhancing the desmear process.

THRU-CUP™DEC-7000 etches the smear from the PCB holes after the sweller pretreatment. The desmear forms a cellular, rough surface, improving palladium absorption and enhancing electroless copper adhesion to the epoxy laminate.

THRU-CUP™ DEC-8000 acidic reducing neutralizer / conditioner solution reduces and dissolves manganese residues following permanganate treatment. The bath neutralizes alkalinity and prevents oxidizer drag into the process.

THRU-CUP™ DEC-9000 glass etch removes and frosts glass filaments, penetrating the PCB hole post desmear.

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Uyemura PCB finishes lead the world in plating performance.

EPIG (Electroless Palladium Immersion Gold) is a patented product and process of Uyemura.

For more details, or to arrange test processing,
contact your Uyemura representative.