Desmear Products
Thru-Cup DEC-6000 permanganate desmear pretreatment increases electroless and electrolytic copper adhesion. DEC-6000 softens and swells the laminate, enhancing the desmear process.
Thru-Cup DEC-7000 etches the smear from the PCB holes after the sweller pretreatment. The desmear forms a cellular, rough surface, improving palladium absorption and enhancing electroless copper adhesion to the epoxy laminate.
Thru-Cup DEC-8000 acidic reducing neutralizer / conditioner solution reduces and dissolves manganese residues following permanganate treatment. The bath neutralizes alkalinity and prevents oxidizer drag into the process.
Thru-Cup DEC-9000 glass etch removes and frosts glass filaments, penetrating the PCB hole post desmear.