Electroless Copper Processes

Thru-Cup JR-660 is a high performance electroless copper process with exceptional deposition consistency and adhesion on hole walls and other board surfaces. JR-660 exhibits lateral growth, resulting in excellent coverage in both through holes and micro-vias. The copper deposit is dense, with a fine grain structure.

Thru-Cup JR-760 medium build electroless copper bath has a high-performance deposition rate (1.5 – 1.8 microns (60-70 μins) in 30 minutes.) It is excellent for through hole and micro-via coverage with exceptional adhesion on hole walls and other board surfaces.

Desmear Products

Thru-Cup DEC-6000 permanganate desmear pretreatment increases electroless and electrolytic copper adhesion. DEC-6000 softens and swells the laminate, enhancing the desmear process.

Thru-Cup DEC-7000 etches the smear from the PCB holes after the sweller pretreatment. The desmear forms a cellular, rough surface, improving palladium absorption and enhancing electroless copper adhesion to the epoxy laminate.

Thru-Cup DEC-8000 acidic reducing neutralizer / conditioner solution reduces and dissolves manganese residues following permanganate treatment. The bath neutralizes alkalinity and prevents oxidizer drag into the process.

Thru-Cup DEC-9000 glass etch removes and frosts glass filaments, penetrating the PCB hole post desmear.

Powered by science
Focused on customers

Uyemura PCB finishes lead the world in plating performance.

For more details, or to arrange test processing,
contact your Uyemura representative.

CONTACT