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Bright Gold Plating

Soft gold electrolytes

Auruna® 550 neutral electrolyte deposits pure gold coatings where lifting of fully aqueous resists is an issue and where excellent bondability and solderability are required. Deposits exhibit excellent ductility, hardness below 90 HK25, low contact resistance, and 99.9% purity. Auruna 550 deposits meet ASTM B488 Type III, Code A.

Auruna 551 mildly acidic electrolyte deposits thin, pure gold (0.05-0.1 μm) as gold strike layers for neutral or alkaline gold plating baths. It provides adhesive activation of the basic material and protects the main gold bath from contamination.

Automobile oxygen sensor

Auruna 553 neutral fine gold electrolyte produces coatings of exceptional ductility. Deposits are up to 200 μm; hardness is approximately 90 HV 0.01. Auruna 553 has excellent soldering and bonding properties and meets ASTM B488-01, Type III, Code B.

Auruna 556 neutral electrolyte deposits hard, bright pure gold with a current efficiency of 90%. 556 is well suited for use with PCBs where lifting of the resist by hydrogen should be avoided.

Auruna 5000 neutral electrolyte deposits a fine microcrystalline coating. It was developed for flexible PCBs and rigid substrates. PCBs are plated in matte nickel, strike gold plated, then coated in Auruna 5000. Gold layers exhibit excellent bondability and solderability, high ductility and low electrical resistance. Auruna 5000 layers are 99.95% pure gold, with as-plated hardness of 70-85 HV 0.025. Coating meets the requirements of ASTM B-488-01, Type III, Code A/B.

Hard Gold Electrolytes

Auruna 215 hard gold electrolyte is nickel and cobalt-free.

Auruna 311 gold-cobalt electrolyte was engineered for the direct gold plating of tungsten, stainless steel, nickel and other challenging substrates. RoHS-compliant coating is ductile, low porosity, corrosion-resistant and cyanide-free. Auruna 311 is suitable for both strike gold layers and thick coatings. It has excellent throwing power, and activates without halogenides. It is suitable for rack, barrel and continuous lines; a cobalt-free version is also available.

Auruna 530 hard gold-cobalt electrolyte was developed for electrical contacts. Process provides high current efficiency, hardness of 170 HV 0.01. Bath is mildly acidic. Coating offers excellent abrasion resistance, with a maximum thickness of 5 μm.

Auruna 539 hard gold-cobalt electrolyte produces deposits of 99.7% gold, alloyed with cobalt. Baths have excellent throwing power. Ultra-bright deposits have excellent corrosion and abrasion resistance, and a hardness of 200 HV. Auruna 539 was developed for technical and decorative applications with low coating thickness requirements. Process provides excellent deposit uniformity and a maximum thickness of 2 μm.

Gold Salts

Auruna 6700 Gold Salts are used for cyanide-based gold plating products whether electrolytic, immersion, or electroless.

Hard Silver Gold Replacement

ARGUNA® 630 GAM fine silver electrolyte deposits thick, bright silver layers; it has excellent electrical, bonding and soldering characteristics and a hardness range of 120 HV to 130 HV. Arguna 630 is ideal for high mechanical stress applications, and significantly increases mating cycles and contact durability. A reflection density up to 1.5 GAM, and high temperature resistance, make it an excellent final finish for LEDs; it is also a high-quality conducting material for medical device and aerospace applications.coatings. It is carbonate-tolerant, and has excellent throwing power and a wide current density range. Strike silver plating is unnecessary for deposition on nickel.

Bright Silver Electrolyte

ARGUNA 621 deposits semi-bright white coatings. It is carbonate-tolerant, and has excellent throwing power and a wide current density range. Strike silver plating is unnecessary for deposition on nickel.

NTB-302 electrolytic tin produces a uniform coating of pure tin for chip resistors, chip capacitors, chip inductors, and other applications that can’t be exposed to acidic solutions. Deposited film of electrolytic tin has exceptionally uniform grain structure and excellent solderability.

GRX-70 high-speed electrolytic plating process dissipates compressive stress, preventing whisker formation. It offers high deposition speeds for rackless and reel-to-reel processing, and high deposition efficiency over a wide current density range. The bath is lead and fluoride-free, and foam-resistant. The film is heat-resistant, with excellent solderability.

Auruna 311 gold-cobalt electrolyte was engineered for the direct gold plating of tungsten, stainless steel, nickel and other difficult-to-plate substrates. This RoHS-compliant coating is ductile, low porosity, corrosion-resistant, and cyanide-free. Auruna 311 is suitable for both strike gold layers and thick coatings. It has excellent throwing power, and activates without halogenides. It is suitable for rack, barrel and continuous lines; a cobalt-free version is also available.

TWX-40 Reduction Assisted Immersion Gold (“RAIG”) plates, in one step, up to 4-8 μin gold. Using immersion and autocatalytic deposition, deposits are exceptionally uniform and low in porosity, minimizing palladium’s exposure to the environment. TWX-40 is the chemistry of choice for applications requiring heavier gold. It is also valued for its ability to withstand corrosive atmospheres, and for its fast deposition rate.

Gobright TAM-55 minimizes nickel corrosion, optimizes gold distribution
Gobright TAM-LC neutral immersion gold bath for SMT
Gobright TAW-66 immersion gold for ENIG formulated to minimize nickel corrosion
Gobright TCU-38 low gold concentration bath formulated to minimize corrosion
Gobright TCU-41 direct immersion gold for copper
Gobright TFR-33 immersion gold bath for SMT
Gobright TLA-77 immersion gold providing excellent solderjoint reliability

Gobright TMX/21/23 is an alternative autocatalytic gold, a neutral autocatalytic/ electroless gold process

AubBEL Electroless Gold is a stable, alkaline pH, autocatalytic process that deposits greater than 99.9% pure gold at 80 μin/hr. It has excellent gold wire bond characteristics.

Sealing 691 nanotechnology-based anti-tarnish process provides high levels of protection from tarnish and corrosion, and robust technical properties. Sealing 691’s proprietary organic molecule has a unique affinity for electrodeposition. It has a dwell time as short as 4 seconds, compared to competitive products at approximately 30 seconds. Layers applied with an electrical potential can be deposited at high density (low porosity), resulting in exceptional corrosion performance. Sealing 691 maintains contact resistance well below 10 MΩ.

Auruna® 7100 operates at high current densities and deposition rates. Coatings are brilliant, hard, solderable, and abrasion resistant, with consistently low contact resistance.

Auruna 8100 offers highest plating speeds, and an extended operating range. Hard gold coatings are low-porosity and wear resistant.

Palluna® ACF-100 chloride-free palladium nickel electrolyte produces ductile, crack-free deposits that resist abrasion. With contact properties comparable to hard gold, it is a cost-effective option; the electrolyte deposits alloy coatings of approximately 80% Pd; hardness is 500-550 HV.

Niphos® 965 electrolyte produces the ideal intermediate layer prior to hard gold plating. PH stable process is superior to EN, producing layers that are amorphous, diamagnetic and abrasion and corrosion resistant. Niphos is contaminant-tolerant and free of halides, chloride, lead and cadmium.

Miralloy® 2841 HS replaces silver, palladium and nickel for many applications. This versatile alloy is 51% copper, 33% tin and 17% zinc; it deposits up to 2 μm at .9 μm/minute. Miralloy is abrasion resistant, with a hardness value equal to electroplated nickel. It has excellent solderability, is tarnish-free, RoHS compliant, and diamagnetic.

Rhoduna-Alloy 1 is formulated from rhodium and ruthenium, with whiteness and performance equal to the highest quality rhodium coatings. It deposits directly on nickel, palladium, silver and gold, and exhibits good throwing power on complex geometries. Deposit thickness can be modified without altering its color; deposits are crack-free up to 1 μm.

Reel-to-Reel Gold plating

Auruna® 7100 operates at high current densities and deposition rates, is ideally suited to reel-to-reel systems. Coatings are brilliant, hard, solderable, and abrasion resistant, with consistently low contact resistant.

Auruna 8100 offers highest plating speeds, and an extended operating range. Hard gold coatings are low-porosity and wear resistant.

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