Reduction-Assisted Immersion Gold meets the demand for gold deposits of 4-8 μin with 0 corrosion
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Talon for ENEPIG Electroless /Alloyed Palladium Phos deposits directly onto Cu, Al, electroless nickel
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EPIG for HF, microwave, flex circuits plates fine patterns with L/S of less than 20 microns
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Direct Immersion Gold for High Frequency applications directly deposits gold onto copper using an electroless process; heavy gold layers are possible
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C100 – silver dispersive plating technology retains many of silver’s conductive properties, protects against tarnish, friction, wear
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Topseal 693 – silver anti-tarnish withstands high heat and voltages without compromise of contact resistance or resistivity
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Gold Miralloy – industry’s most cost effective gold alternative for decorative plating. Deposits up to 15 μm with exceptional uniformity.
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PLATUNA® N1 – Electrolytic platinum deposits directly on titanium; coatings are crack-free up to 1 μm. Used on electrodes, catalysts, receptors, connectors.
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