Reduction-Assisted Immersion Gold meets the demand for gold deposits of 4-8 μin with 0 corrosion
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Talon for ENEPIG Electroless /Alloyed Palladium Phos deposits directly onto Cu, Al, electroless nickel
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EPIG for HF, microwave, flex circuits plates fine patterns with L/S of less than 20 microns
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Broadest UBM portfolio of EPIG, ENEPIG and ENIG options for aluminum, copper and other substrates
C100 – Silver Dispersion; Extends wear cycles to 10,000+ without lubrication; Superior resistance to tarnishing & high temps; Low contact resistance
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Topseal 693 – Anti-tarnish for Silver; Withstands high heat & voltages without compromise of contact resistance or resistivity; Dry, self-lubricating inorganic conversion coating
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Arguna 630 – Hard Silver Electrolyte; For high stress and high wear applications; Extends wear cycles to 2000+ without lubrication; High voltage compatible
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Palladium Gold – a high diffusion palladium barrier coupled with a low-porosity gold deposit; highly effective for medical spectrometry & similar applications.
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