Global Leader in Final Finishes
and Functional Coatings

Reduction-Assisted Immersion Gold meets the demand for gold deposits of 4-8 μin with 0 corrosion

Talon for ENEPIG Electroless /Alloyed Palladium Phos deposits directly onto Cu, Al, electroless nickel

EPIG for HF, microwave, flex circuits plates fine patterns with L/S of less than 20 microns

Direct Immersion Gold for High Frequency applications directly deposits gold onto copper using an electroless process; heavy gold layers are possible

C100 – silver dispersive plating technology retains many of silver’s conductive properties, protects against tarnish, friction, wear

Topseal 693 – silver anti-tarnish withstands high heat and voltages without compromise of contact resistance or resistivity

Miralloy – industry’s most cost-effective alternative to silver, palladium and nickel for high frequency and other applications

Rhoduna PT – platinum/rhodium alloy with whiteness and reflectivity virtually equal to the highest quality rhodium coatings

UYEMURA Corporate Headquarters:
3990 Concours, #425 • Ontario, CA 91764 • ph: (909) 466-5635

UYEMURA Tech Center:
240 Town Line Road • Southington, CT 06489 • ph: (860) 793-4011