Reduction-Assisted Immersion Gold meets the demand for gold deposits of 4-8 μin with 0 corrosion
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Talon for ENEPIG Electroless /Alloyed Palladium Phos deposits directly onto Cu, Al, electroless nickel
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EPIG for HF, microwave, flex circuits plates fine patterns with L/S of less than 20 microns
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Broadest UBM portfolio of EPIG, ENEPIG and ENIG options for aluminum, copper and other substrates
PLATUNA-Alloy 1 – platinum / ruthenium 75/25; extraordinary abrasion resistance; perfect for jewelry, decorative applications
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RHODUNA-Alloy 1 is world’s first galvanic rhodium alloy; rhodium brightness and performance; deposits directly on Ni, Pd, Ag and Au; crack-free up to 1 μm.
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NIPHOS 968 electrolytic nickel produces a bright, RoHS finish with corrosion properties equal to EN and is ideal for high frequency use
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MIRALLOY –the best alternative to Ag, Pd, Ni; ideal diffusion barrier layer; excellent solderability, high hardness, tarnish free; best option for HF connectors
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