Reduction-Assisted Immersion Gold meets the demand for gold deposits of 4-8 μin with 0 corrosion
Read More
Talon for ENEPIG Electroless /Alloyed Palladium Phos deposits directly onto Cu, Al, electroless nickel
Read More
EPIG for HF, microwave, flex circuits plates fine patterns with L/S of less than 20 microns
Read More
Direct Immersion Gold for High Frequency applications directly deposits gold onto copper using an electroless process; heavy gold layers are possible
Read More
C100 Silver Dispersive Plating Technology Retains Many of Silver’s Conductive Properties, + Anti-tarnish Protection & Improved Friction/Wear Characteristics
Read More
Topseal 693 – Silver Anti-tarnish is a thin, invisible inorganic conversion coating.
Read More
Arguna 630 – Hard Silver Electrolyte; For high stress and high wear applications; Extends wear cycles to 2000+ without lubrication; High voltage compatible
Read More
Palladium Gold – a high diffusion palladium barrier coupled with a low-porosity gold deposit; highly effective for medical spectrometry & similar applications.
Details Soon