Immersion Silver and Immersion Semi-autocatalytic Gold (ISIG)
The ISIG process was engineered for the elevated requirements of fine patterns and high frequency signal transfer. ISIG produces a dense, homogenous gold protection layer up to .0.3µm.
This high-performing nickel-free coating provides highly uniform electroless deposition, high solderability, and bondability with aluminum and gold wire. Other advantages include:
- High conductivity
- Ductile finish that's ideally suited to flex PCBs.
- Suitability for ultra fine pitch layouts
- Reliable Pb-free and Sn/Pb soldering
- Practical applications in HF, medical technology
- Compliant with newest RoHs and WEEE regulations