Pre-APEX edition of “Clear Signals” explores one of the most contested – and contentious – issues in board manufacturing: customer demand for heavier gold as the final ENIG / ENEPIG step. Also: a copper plating system, created for aspect ratios of 1:1 or less, that fills blind vias 30-145 microns at unprecedented speeds with ≤ 15% dimple.
Surface Performance Newsletter
Newsletter for general metal finishing profiles New England powerhouse, Unimetal, its experience with advanced trimetal technology and organic nanotech sealants, and its moves toward closed loop operation. Business Development Manager Rich DePoto explains the essentials of REACH– a must for US mfgs. selling into the EU. Also: a cyanide-free, semi-bright copper electroplate that’s an ideal base for bright nickel, chrome, gold.
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The IGEPIG Process
Flyer summarizes the 7 performance metrics of IGEPIG (Immersion Gold, Electroless Palladium, Immersion Gold) – a process exclusive to Uyemura.
Uyemura In-line Solution
Flyer describes Uyemura chemistry that seamlessly converts an existing ENIG or ENEPIG line into one capable of processing all 3 major finishes: ENIG, ENEPIG and EPIG.
General Metal Finishing
Miralloy Sn/ Pd/ Ni replacement in 4 formulations, including cyanide-free; electroless nickels, decorative finishes, technical finishes, gold electrolytes, high corrosion-resistant alloys
ENIG/ENEPIG, EPIG, electroless palladium for ENEPIG in 3 formulas; nickel-phos, immersion gold/ silver/ tin, mixed reaction autocatalytic gold, nanosealer
Acid Copper Plating
Through-hole plating: acid copper additive for high aspect ratios with fine line circuitry; void-free via fill, MEC copper etchants
MEC PCB Solutions
MEC surface treatments to promote adhesion of dry film, soldermask and laminate, are described in a new brochure.
EN Plating Control Technology
Brochure describes STARLiNE DASH technology for automated sampling, analysis and replenishment of EN baths with exceptional accuracy.
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New Nickel Phosphorus Electrolytes Make Plating Jobs Easier
Business Development Manager Rich DePoto discusses the significance of new electrolytic nickel-phos technology for manufacturers of high frequency wireless devices with Modern Metals writer Lynn Stanley.
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Platinized Titanium and MMO Anodes in Electroplating Applications
Electrolytic Nickel-Phosphorus Plating