Literature

Resource Type

Applications

Article on Minimizing Signal Transmission Loss in High-Frequency Circuits
Application of Nonlinear Regression for Determining PCB Finish Thicknesses

Nonlinear regression is a powerful statistical tool, but it can be challenging to find the appropriate model and starting parameters. Understanding how to choose the proper model and starting parameters is critical. Linear and nonlinear regression methods are reviewed, and a worked example using electroless nickel immersion gold (ENIG) is provided.

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Article on Minimizing Signal Transmission Loss in High-Frequency Circuits
Quality and Continuous Improvement

Quality and continuous improvement are an integral part of the electronics industry. Poor quality is costly. Remediation costs of poor quality can cost a company 25% of its annual sales. Poor quality and the need for high reliability are the catalysts driving continuous improvement today. An in-depth review of quality and continuous improvement is presented.

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Reduction-Assisted Immersion Gold for ENIG, ENEPIG
Reduction-Assisted Immersion Gold for ENIG, ENEPIG

Flyer summarizes the benefits and advantages of RAIG – Reduction Assisted Immersion Gold as a high-performing gold alternative for ENIG and ENEPIG. Uyemura’s TWX-40 assures compliance with IPC 4552 as well as long term deposit layer reliability.

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EDACafe Interviews Rich DePoto
Video

Rich DePoto shared insights on final finishes for the PCB, additive and semiconductor industries in this interview with Sanjay Gangal of EDA Cafe. Key topics to the wide-ranging interview included the factors driving industry’s conversion from ENIG to ENEPIG, and the role of thicker gold deposits, particularly in hydrostatic and pogo pin assemblies. Uyemura has the world’s largest portfolio of thick gold electroless processes.

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I-Connect007 Interviews Rich DePoto at IPC APEX 2020
Video

I-Connect007 Interviews Rich DePoto who discusses the market acceptance of the RAIG heavy gold process, the demand for and the benefits of the ENEPIG process, and how the EPIG process satisfies applications where high-frequency SI and non-magnetic properties are mandatory and nickel must not be present.

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Article on Minimizing Signal Transmission Loss in High-Frequency Circuits
Via Plating for PWBs

Vias are an integral part of PWB design and manufacturing. They are the means by which different layers of a board are connected. There are three main types of vias: through-hole vias, buried vias, and blind vias.

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Article on Minimizing Signal Transmission Loss in High-Frequency Circuits
Minimizing Signal Transmission Loss in High-Frequency Circuits
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Article on EPIG: A Nickel-free Surface Finish for Next-generation Products
EPIG: A Nickel-free Surface Finish for Next-generation Products
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Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold
Eliminating Ni Corrosion in ENIG/ENEPIG Using Reduction-Assisted Immersion Gold in Place of Standard Immersion Gold
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Circuitnet - Viewpoint 2020
Circuitnet – Viewpoint 2020

Tony Revier, President of Uyemura USA, discusses the four significant trends that position Uyemura for success in this new decade.

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Semiconductor Packaging News - Viewpoint 2020
Semiconductor Packaging News – Viewpoint 2020

Uyemura Vice President, Don Gudeczauskas discusses how smaller form factors, shorter lead times, and harsh environment adaptability continue to push the industry into new territory.

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Uyemura In-line Solution
The EPIG Process

Flyer for Uyemura’s EPIG, nickel-free PCB finish, has opened up a wide, new design avenue for high frequency applications and designs with reduced spacing. The EPIG process deposits palladium directly onto copper, a perfect fit for applications that demand smaller features and better clearances.

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I-Connect007 Interviews Rich DePoto at IPC APEX 2019
Audio

PCB Chat Interviews George Milad who discusses how the IPC-4552 ENIG specification is being revised to reflect new corrosion analysis requirements.

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The IGEPIG Process
The IGEPIG Process

Flyer summarizes the 7 performance metrics of IGEPIG (Immersion Gold, Electroless Palladium, Immersion Gold) – a process exclusive to Uyemura.

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Uyemura In-line Solution
Uyemura In-line Solution

Flyer describes Uyemura chemistry that seamlessly converts an existing ENIG or ENEPIG line into one capable of processing all 3 major finishes: ENIG, ENEPIG and EPIG.

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Uyemura In-line Solution
General Metal Finishing

Miralloy Sn/ Pd/ Ni replacement in 4 formulations, including cyanide-free; electroless nickels, decorative finishes, technical finishes, gold electrolytes, high corrosion-resistant alloys

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Uyemura In-line Solution
Final Finishes

ENIG/ENEPIG, EPIG, electroless palladium for ENEPIG in 3 formulas; nickel-phos, immersion gold/ silver/ tin, mixed reaction autocatalytic gold, nanosealer

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Uyemura In-line Solution
Acid Copper Plating

Through-hole plating: acid copper additive for high aspect ratios with fine line circuitry; void-free via fill, MEC copper etchants

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Uyemura In-line Solution
MEC PCB Solutions

MEC surface treatments to promote adhesion of dry film, soldermask and laminate, are described in a new brochure.

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EN Plating Control Technology
EN Plating Control Technology

Brochure describes STARLiNE DASH technology for automated sampling, analysis and replenishment of EN baths with exceptional accuracy.

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Rhoduna-Alloy 1 Galvanic Rhodium Alloy
Rhoduna-Alloy 1 Galvanic Rhodium Alloy

Formulated from rhodium and ruthenium; whiteness and performance is equal to the highest quality rhodium coatings, with greater smoothness and durability. Deposits directly on nickel, palladium, silver and gold; crack-free up to 1 μm.

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Platinized Titanium and MMO Anodes in Electroplating Applications
Platinized Titanium and MMO Anodes in Electroplating Applications

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Electrolytic Nickel-Phosphorus Plating
Electrolytic Nickel-Phosphorus Plating

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I-Connect007 Interviews Rich DePoto at IPC APEX 2019
Video

I-Connect007 Interviews Rich DePoto.

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Uyemura provides market-leading metal finishing solutions and a sales and technical team unrivaled in its experience, knowledge and dedication.
Video

Uyemura provides market-leading metal finishing solutions and a sales and technical team unrivaled in its experience, knowledge and dedication.

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Meet the sales and technical team behind Uyemura's final finishes!
Video

Meet the sales and technical team behind Uyemura’s final finishes!

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Barrier Properties of an Electroless Deposit of Co-W-P Alloy
Barrier Properties of an Electroless Deposit of Co-W-P Alloy
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Characteristics of EPIG Deposits for Fine Line Applications
Characteristics of EPIG Deposits for Fine Line Applications
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Surface Finishes in a Lead Free World
Surface Finishes in a Lead Free World
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Direct Immersion Gold as a Final Finish
Direct Immersion Gold as a Final Finish
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Solder Joint Reliability of Gold Surface Finishes: ENIG, ENEPIG, DIG for PWB Assembled with Lead Free SAC Alloyd
Solder Joint Reliability of Gold Surface Finishes: ENIG, ENEPIG, DIG for PWB Assembled with Lead Free SAC Alloy
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Study of Ni-P / Pd / Au as a Final Finish for Silicon Wafers
Study of Ni-P / Pd / Au as a Final Finish for Silicon Wafers
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>Smooth Finish - Satin Nickel Plating Scores in Auto and Other Applications
Smooth Finish – Satin Nickel Plating Scores in Auto and Other Applications
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Characteristics of a Lead and Cadmium Free Electroless Nickel
Characteristics of a Lead and Cadmium Free Electroless Nickel
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Under Bump Metallization to Reduce Wafer Processing Costs
Under Bump Metallization to Reduce Wafer Processing Costs
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Electroless Plating for LTCC Metallization
Electroless Plating for LTCC Metallization
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ENeutral Autocatalytic Electroless Gold Plating Process
Neutral Autocatalytic Electroless Gold Plating Process
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Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead-free Soldering and Gold Wire Bonding
Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead-free Soldering and Gold Wire Bonding
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Study of the ENEPIG IMC for Eutectic and LF Solders
Study of the ENEPIG IMC for Eutectic and LF Solders
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Uyemura Surface Treatment Process Zeroes in on Tin
Uyemura Surface Treatment Process Zeroes in on Tin
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ENIG with Ductile Electroless Nickel for Flex Circuit Applications
ENIG with Ductile Electroless Nickel for Flex Circuit Applications
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Elimination of Whiskers from Electroplated Tin
Elimination of Whiskers from Electroplated Tin
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Electrolytic Nickel-Phosphorus Plating
Electrolytic Nickel-Phosphorus Plating
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Innovative Solutions for Leading Edge Designs
Innovative Solutions for Leading Edge Designs
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Surface Finishing for Lead-Free
Surface Finishing for Lead-Free
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Printed Circuit Boards: Final Finish Options
Printed Circuit Boards: Final Finish Options
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What's New in Vertical Acid Copper Plating for PCB Manufacturing
What's New in Vertical Acid Copper Plating for PCB Manufacturing
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New Developments in DC Acid Copper for Vertical Plating Tanks
New Developments in DC Acid Copper for Vertical Plating Tanks
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ENEPIG and Nickel Corrosion
ENEPIG and Nickel Corrosion
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Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
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